Inventor · disambiguated record
Tomoyuki Fujinami
Also filed as: FUJINAMI TOMOYUKI
3 granted patents·1 pending application·17 citations·filing 1996–2011
65Inventor score
Top patents by PatentIndex Score
4 records- 0164US8771409B2Electroless gold plating solution and electroless gold plating methodASAKAWA TAKANOBU·Filed 2011·Granted Jul 8, 2014·1 cites·20 claims
- 0240US6193789B1Electroless copper plating solution and method for electroless copper platingHONMA HIDEO·Filed 1996·Granted Feb 27, 2001·12 cites·3 claims
- 0329US2002046679A1Microporous copper film and electroless copper plating solution for obtaining the sameHIDEO HONMA·Filed 2001·Application pending·0 cites
- 0424US6329072B1Microporous copper film and electroless copper plating solution for obtaining the sameHONMA NIDEO·Filed 1998·Granted Dec 11, 2001·4 cites·4 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →