Inventor · disambiguated record
Kamal K. Sikka
Also filed as: SIKKA KAMAL · SIKKA KAMAL K · SIKKA KAMAL KUMAR
86 granted patents·11 pending applications·860 citations·filing 1999–2024
99Inventor score
Top patents by PatentIndex Score
97 records- 0199US10553522B1Semiconductor microcoolerIBM·Filed 2018·Granted Feb 4, 2020·20 cites·6 claims
- 0298US11164817B2Multi-chip package structures with discrete redistribution layersIBM·Filed 2019·Granted Nov 2, 2021·32 cites·20 claims
- 0398US7516776B2Microjet module assemblyIBM·Filed 2005·Granted Apr 14, 2009·68 cites·2 claims
- 0497US8299608B2Enhanced thermal management of 3-D stacked die packagingBARTLEY GERALD K·Filed 2010·Granted Oct 30, 2012·60 cites·23 claims
- 0597US7992627B2Microjet module assemblyIBM·Filed 2008·Granted Aug 9, 2011·55 cites·21 claims
- 0697US7928562B2Segmentation of a die stack for 3D packaging thermal managementIBM·Filed 2008·Granted Apr 19, 2011·58 cites·18 claims
- 0795US10541156B1Multi integrated circuit chip carrier packageIBM·Filed 2018·Granted Jan 21, 2020·16 cites·20 claims
- 0895US9089052B2Multichip module with stiffening frame and associated coversIBM·Filed 2014·Granted Jul 21, 2015·17 cites·8 claims
- 0994US10757833B2Cooling structure for electronic boardsIBM·Filed 2019·Granted Aug 25, 2020·7 cites·17 claims
- 1094US10553516B1Semiconductor microcoolerIBM·Filed 2018·Granted Feb 4, 2020·10 cites·6 claims
- 1194US9735083B1Adjustable heat sink fin spacingIBM·Filed 2016·Granted Aug 15, 2017·7 cites·8 claims
- 1294US9401315B1Thermal hot spot cooling for semiconductor devicesGLOBALFOUNDRIES INC·Filed 2015·Granted Jul 26, 2016·16 cites·20 claims
- 1394US7031162B2Method and structure for cooling a dual chip module with one high power chipIBM·Filed 2003·Granted Apr 18, 2006·97 cites·19 claims
- 1493US10566313B1Integrated circuit chip carrier with in-plane thermal conductance layerIBM·Filed 2018·Granted Feb 18, 2020·8 cites·20 claims
- 1593US9366591B2Determining magnitude of compressive loadingIBM·Filed 2014·Granted Jun 14, 2016·10 cites·12 claims
- 1693US6294408B1Method for controlling thermal interface gap distanceIBM·Filed 1999·Granted Sep 25, 2001·156 cites·18 claims
- 1791US10172258B2Cooling structure for electronic boardsIBM·Filed 2017·Granted Jan 1, 2019·5 cites·10 claims
- 1890US9437515B2Heat spreading layer with high thermal conductivityIBM·Filed 2015·Granted Sep 6, 2016·6 cites·1 claims
- 1990US7812438B2Via offsetting to reduce stress under the first level interconnect (FLI) in microelectronics packagingIBM·Filed 2008·Granted Oct 12, 2010·21 cites·11 claims
- 2088US10424527B2Electronic package with tapered pedestalIBM·Filed 2017·Granted Sep 24, 2019·5 cites·20 claims
- 2188US7250576B2Chip package having chip extension and methodIBM·Filed 2005·Granted Jul 31, 2007·17 cites·12 claims
- 2287US10580738B2Direct bonded heterogeneous integration packaging structuresIBM·Filed 2018·Granted Mar 3, 2020·4 cites·15 claims
- 2387US10490480B1Copper microcooler structure and fabricationIBM·Filed 2018·Granted Nov 26, 2019·4 cites·25 claims
- 2487US10088244B2Adjustable heat sink fin spacingIBM·Filed 2017·Granted Oct 2, 2018·3 cites·20 claims
- 2587US9721870B2Cooling structure for electronic boardsIBM·Filed 2014·Granted Aug 1, 2017·5 cites·16 claims
- 2687US7768121B2Apparatus and methods for cooling semiconductor integrated circuit package structuresIBM·Filed 2007·Granted Aug 3, 2010·13 cites·14 claims
- 2787US6292367B1Thermally efficient semiconductor chipIBM·Filed 2000·Granted Sep 18, 2001·47 cites·13 claims
- 2885US10490481B1Copper microcooler structure and fabricationIBM·Filed 2018·Granted Nov 26, 2019·3 cites·20 claims
- 2985US9089051B2Multichip module with stiffening frame and associated coversIBM·Filed 2013·Granted Jul 21, 2015·6 cites·12 claims
- 3084US8445331B2Multichip electronic packages and methods of manufactureKADAKIA SURESH D·Filed 2012·Granted May 21, 2013·6 cites·17 claims
- 3183US11527462B2Circuit substrate with mixed pitch wiringIBM·Filed 2019·Granted Dec 13, 2022·3 cites·11 claims
- 3282US11302651B2Laminated stiffener to control the warpage of electronic chip carriersIBM·Filed 2019·Granted Apr 12, 2022·2 cites·19 claims
- 3381US11049844B2Semiconductor wafer having trenches with varied dimensions for multi-chip modulesIBM·Filed 2019·Granted Jun 29, 2021·3 cites·4 claims
- 3481US8794079B2Determining magnitude of compressive loadingBODENWEBER PAUL F·Filed 2011·Granted Aug 5, 2014·3 cites·9 claims
- 3581US7875972B2Semiconductor device assembly having a stress-relieving buffer layerIBM·Filed 2009·Granted Jan 25, 2011·10 cites·17 claims
- 3680US7733655B2Lid edge capping loadIBM·Filed 2008·Granted Jun 8, 2010·11 cites·16 claims
- 3780US7319591B2Optimized thermally conductive plate and attachment method for enhanced thermal performance and reliability of flip chip organic packagesIBM·Filed 2005·Granted Jan 15, 2008·7 cites·10 claims
- 3879US10991635B2Multiple chip bridge connectorIBM·Filed 2019·Granted Apr 27, 2021·2 cites·20 claims
- 3974US9226426B2Electronic device console with natural draft coolingBODENWEBER PAUL F·Filed 2012·Granted Dec 29, 2015·2 cites·18 claims
- 4073US10665524B2Electronic package cover having underside ribIBM·Filed 2017·Granted May 26, 2020·1 cites·16 claims
- 4173US10607928B1Reduction of laminate failure in integrated circuit (IC) device carrierIBM·Filed 2019·Granted Mar 31, 2020·1 cites·20 claims
- 4273US10593564B2Lid attach optimization to limit electronic package warpageIBM·Filed 2018·Granted Mar 17, 2020·1 cites·6 claims
- 4372US10083886B2Lid attach optimization to limit electronic package warpageIBM·Filed 2017·Granted Sep 25, 2018·1 cites·7 claims
- 4472US8232636B2Reliability enhancement of metal thermal interfaceHUMENIK JAMES N·Filed 2010·Granted Jul 31, 2012·5 cites·24 claims
- 4571US10937764B2Three-dimensional microelectronic package with embedded cooling channelsIBM·Filed 2019·Granted Mar 2, 2021·1 cites·17 claims
- 4671US10584924B2Adjustable heat sink fin spacingIBM·Filed 2017·Granted Mar 10, 2020·0 cites·5 claims
- 4770US11825592B2Electronic device console with natural draft coolingIBM·Filed 2020·Granted Nov 21, 2023·0 cites·19 claims
- 4869US8592970B2Multichip electronic packages and methods of manufactureSIKKA KAMAL K·Filed 2011·Granted Nov 26, 2013·3 cites·24 claims
- 4969US8587114B2Multichip electronic packages and methods of manufactureKADAKIA SURESH D·Filed 2010·Granted Nov 19, 2013·2 cites·19 claims
- 5068US8717043B2Determining thermal interface material (TIM) thickness changeBODENWEBER PAUL F·Filed 2011·Granted May 6, 2014·2 cites·19 claims
Showing the top 50 of 97 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →