Inventor · disambiguated record
Tsung-Yen Lee
Also filed as: LEE TSUNG-YEN
29 granted patents·19 pending applications·115 citations·filing 2011–2025
95Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD44NAT UNIV TSING HUA1TAIWAN INTELLIGENT ROBOTICS COMPANY LTD1TPV ELECTRONICS FUJIAN CO LTD1YU ZUO-SHANG1
Top patents by PatentIndex Score
48 records- 0198US11557559B2Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jan 17, 2023·5 cites·20 claims
- 0297US11967582B2Multi-chip device and method of formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 23, 2024·2 cites·20 claims
- 0397US11637087B2Multi-chip device and method of formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Apr 25, 2023·3 cites·20 claims
- 0496US12124178B2Lithography system and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 22, 2024·2 cites·20 claims
- 0595US11984314B2Particle removal methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 14, 2024·3 cites·20 claims
- 0695US11675280B2Lithography system and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 13, 2023·2 cites·20 claims
- 0795US11282756B2Organic interposer including stress-resistant bonding structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 22, 2022·3 cites·20 claims
- 0893US8368322B2Driving circuit for LED lampTPV ELECTRONICS FUJIAN CO LTD·Filed 2011·Granted Feb 5, 2013·65 cites·10 claims
- 0991US2025364488A1Multi-chip device and method of formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1089US9127984B2SERS-active structure, fabrication method thereof, and SERS system comprising the sameNAT UNIV TSING HUA·Filed 2013·Granted Sep 8, 2015·13 cites·20 claims
- 1187US12394752B2Multi-chip device and method of formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Aug 19, 2025·0 cites·20 claims
- 1287US11694974B2Semiconductor die with warpage release layer structure in package and fabricating method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 4, 2023·1 cites·20 claims
- 1385US11982944B2Method of lithography process and transferring a reticleTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted May 14, 2024·0 cites·20 claims
- 1485US11062898B2Particle removal apparatus, particle removal system and particle removal methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 13, 2021·3 cites·20 claims
- 1583US11705420B2Multi-bump connection to interconnect structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 18, 2023·1 cites·20 claims
- 1681US12354867B2Particle removal apparatusTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jul 8, 2025·0 cites·20 claims
- 1781US2025364490A1Multiple non-active dies in a multi-die packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1881US2025105191A1Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1980US12283553B2Semiconductor die with warpage release layer structure in package and fabricating method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 22, 2025·0 cites·20 claims
- 2080US11703763B2Method of lithography process using reticle container with discharging deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 18, 2023·0 cites·20 claims
- 2180US2025070050A1Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2278US8476843B2Driving circuit for single-string LED lampYU ZUO-SHANG·Filed 2011·Granted Jul 2, 2013·9 cites·9 claims
- 2377US12191272B2Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jan 7, 2025·0 cites·20 claims
- 2477US12176301B2Package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 24, 2024·0 cites·20 claims
- 2577US2025323234A1Semiconductor package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2676US2025210543A1Semiconductor die with warpage release layer structure in packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2776US2025357301A1Semiconductor packages with reinforcement structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2875US11320733B2Reticle with conductive material structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 3, 2022·0 cites·20 claims
- 2973US11106146B2Lithography system and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 31, 2021·0 cites·20 claims
- 3072US11705406B2Package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 18, 2023·0 cites·20 claims
- 3170US2025239514A1Semiconductor packages with reinforcement structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3269US9412632B2Reticle podTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2012·Granted Aug 9, 2016·3 cites·19 claims
- 3369US2023317661A1Multi-Bump Connection to Interconnect Structure and Manufacturing Method ThereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 3468US10684561B2Lithography methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 16, 2020·0 cites·20 claims
- 3567US2024063208A1Semiconductor package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 3666US2023395563A1Multiple non-active dies in a multi-die packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 3764US10802394B2Method for discharging static charges on reticleTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Oct 13, 2020·0 cites·20 claims
- 3863US11121018B2Method and apparatus for lithography in semiconductor fabricationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 14, 2021·0 cites·20 claims
- 3962US2025300131A1Package structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4060US2025105170A1Semiconductor package including stress-reduction chamfers and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 4159US2025050918A1Track-type robotTAIWAN INTELLIGENT ROBOTICS COMPANY LTD·Filed 2024·Application pending·0 cites
- 4259US2025070033A1Semiconductor package with variable solder resist opening dimensions and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 4359US2025070084A1Package structure including package lid with a recess and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 4458US2025014978A1Package module including an interposer with a dummy via, package structure including the package module and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 4557US2025062176A1Frame edge reinforcement structure for package structures and methods of using the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 4656US10714371B2Method and apparatus for lithography in semiconductor fabricationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 14, 2020·0 cites·20 claims
- 4755US11756873B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 12, 2023·0 cites·20 claims
- 4853US2024222287A1Package including composite interposer and/or composite packaging substrate and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Tsung-Yen Lee files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →