Inventor · disambiguated record
Emerson Mamaril Enipin
Also filed as: ENIPIN EMERSON M · ENIPIN EMERSON MAMARIL
3 granted patents·1 pending application·5 citations·filing 2012–2023
55Inventor score
Technology areasH10W
Top patents by PatentIndex Score
4 records- 0167US8883567B2Process of making a stacked semiconductor package having a clipWYANT MICHAEL TODD·Filed 2012·Granted Nov 11, 2014·5 cites·17 claims
- 0260US11862479B2MCM package isolation through leadframe design and package saw processTEXAS INSTRUMENTS INC·Filed 2021·Granted Jan 2, 2024·0 cites·21 claims
- 0350US11081366B2MCM package isolation through leadframe design and package saw processTEXAS INSTRUMENTS INC·Filed 2018·Granted Aug 3, 2021·0 cites·20 claims
- 0449US2025046668A1Encapsulated wcsp with thermal pad for efficient heat dissipationTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →