Inventor · disambiguated record
Sw Wang
Also filed as: WANG SW · WANG SW WEI
7 granted patents·1 pending application·17 citations·filing 2017–2023
77Inventor score
Technology areasH10W
Files withSEMICONDUCTOR COMPONENTS IND LLC8
Top patents by PatentIndex Score
8 records- 0192US10319639B2Thin semiconductor package and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2017·Granted Jun 11, 2019·15 cites·13 claims
- 0273US10056317B1Semiconductor package with grounding device and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2017·Granted Aug 21, 2018·2 cites·20 claims
- 0371US11791297B2Molded semiconductor package and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Granted Oct 17, 2023·0 cites·18 claims
- 0471US2024006363A1Molded semiconductor package and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Application pending·0 cites
- 0565US11942369B2Thin semiconductor package for notched semiconductor dieSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Mar 26, 2024·0 cites·15 claims
- 0657US10763173B2Thin semiconductor package and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2019·Granted Sep 1, 2020·0 cites·20 claims
- 0753US11244918B2Molded semiconductor package and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2017·Granted Feb 8, 2022·0 cites·16 claims
- 0852US10699989B2Semiconductor package with grounding device and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2018·Granted Jun 30, 2020·0 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →