Inventor · disambiguated record
Sung Won Jeong
Also filed as: JEONG SUNG WON
33 granted patents·17 pending applications·163 citations·filing 2007–2023
96Inventor score
Top patents by PatentIndex Score
50 records- 0199US10109588B2Electronic component package and package-on-package structure including the sameSAMSUNG ELECTRO MECH·Filed 2016·Granted Oct 23, 2018·94 cites·29 claims
- 0293US10128179B2Fan-out semiconductor package and electronic device including the sameSAMSUNG ELECTRO MECH·Filed 2016·Granted Nov 13, 2018·8 cites·33 claims
- 0389US9741630B2Electronic component package and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2016·Granted Aug 22, 2017·5 cites·25 claims
- 0485US10157886B2Fan-out semiconductor packageSAMSUNG ELECTRO MECH·Filed 2017·Granted Dec 18, 2018·4 cites·15 claims
- 0582US10332855B2Fan-out semiconductor packageSAMSUNG ELECTRO MECH·Filed 2017·Granted Jun 25, 2019·6 cites·22 claims
- 0681US12300594B2Fan-out semiconductor package and electronic device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted May 13, 2025·0 cites·19 claims
- 0780US10522451B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Dec 31, 2019·2 cites·20 claims
- 0880US8608072B2Memory card socket and data processing device including the sameJEONG SUNG WON·Filed 2012·Granted Dec 17, 2013·6 cites·18 claims
- 0979US9706668B2Printed circuit board, electronic module and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2015·Granted Jul 11, 2017·4 cites·22 claims
- 1078US10002811B2Electronic component package and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2017·Granted Jun 19, 2018·2 cites·25 claims
- 1177US10461008B2Electronic component package having stress alleviation structureSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Oct 29, 2019·3 cites·20 claims
- 1277US10304807B2Fan-out semiconductor packageSAMSUNG ELECTRO MECH·Filed 2018·Granted May 28, 2019·2 cites·20 claims
- 1377US8142240B2Lead pin for package substrateOH HEUNG JAE·Filed 2010·Granted Mar 27, 2012·6 cites·2 claims
- 1475US10446481B2Fan-out semiconductor package and electronic device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Oct 15, 2019·1 cites·20 claims
- 1575US7884567B2Fuel cell system and method for controlling operation of the fuel cell systemSAMSUNG SDI CO LTD·Filed 2007·Granted Feb 8, 2011·13 cites·11 claims
- 1674US10115648B2Fan-out semiconductor package and electronic device including the sameSAMSUNG ELECTRO MECH·Filed 2016·Granted Oct 30, 2018·2 cites·22 claims
- 1772US11626364B2Fan-out semiconductor package and electronic device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Apr 11, 2023·0 cites·18 claims
- 1872US10861784B2Fan-out semiconductor package and electronic device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Dec 8, 2020·0 cites·20 claims
- 1971US10211136B2Fan-out semiconductor packageSAMSUNG ELECTRO MECH·Filed 2017·Granted Feb 19, 2019·1 cites·18 claims
- 2066US9859243B2Electronic component package and electronic device including the sameSAMSUNG ELECTRO MECH·Filed 2016·Granted Jan 2, 2018·1 cites·6 claims
- 2166US8822841B2Package substrate and fabricating method thereofLEE DONG GYU·Filed 2012·Granted Sep 2, 2014·2 cites·12 claims
- 2265US10679933B2Fan-out semiconductor package and electronic device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jun 9, 2020·0 cites·23 claims
- 2364US8790843B2Fuel cell stackNA YOUNG-SEUNG·Filed 2008·Granted Jul 29, 2014·1 cites·17 claims
- 2462US11121066B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Sep 14, 2021·0 cites·11 claims
- 2553US9929117B2Electronic component package and electronic device including the sameSAMSUNG ELECTRO MECH·Filed 2017·Granted Mar 27, 2018·0 cites·15 claims
- 2652US10490237B2Data storage device and method of operating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Nov 26, 2019·0 cites·20 claims
- 2752US9142499B2Lead pin for package substrateSAMSUNG ELECTRO MECH·Filed 2014·Granted Sep 22, 2015·0 cites·17 claims
- 2851US8232021B2Stack for fuel cellSUH JUN-WON·Filed 2008·Granted Jul 31, 2012·0 cites·12 claims
- 2951US2011079349A1Method of manufacturing printed circuit boardSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 3050US2014144575A1Insulating layer conduction methodSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 3149US10545880B2Memory device and memory system performing an unmapped readSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jan 28, 2020·0 cites·18 claims
- 3249US2015061093A1Interposer and semiconductor package using the same, and method of manufacturing interposerSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 3349US2015101857A1Printed circuit board and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 3449US2015129291A1Printed circuit board and method of manufacturing printed circuit boardSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 3548US2011076472A1Package substrateKIM JIN HO·Filed 2009·Application pending·0 cites
- 3648US2011067901A1Package substrateKIM JIN HO·Filed 2009·Application pending·0 cites
- 3748US2013334033A1Method for manufacturing razor blade edge and razor blade for razorJEONG SUNG WON·Filed 2012·Application pending·0 cites
- 3847US2009092873A1Fuel cell stackJEONG SUNG-WON·Filed 2008·Application pending·0 cites
- 3943US2014102767A1Multi-layer type printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 4041US2013168144A1Printed circuit board and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2012·Application pending·0 cites
- 4140US9836220B2Data processing system and method of operating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Dec 5, 2017·0 cites·14 claims
- 4239US10445010B2Nonvolatile memory device and method of throttling temperature of nonvolatile memory deviceJEONG SUNG WON·Filed 2017·Granted Oct 15, 2019·0 cites·17 claims
- 4338US8766450B2Lead pin for package substrateLEE KI TAEK·Filed 2010·Granted Jul 1, 2014·0 cites·13 claims
- 4438US2012118621A1Printed circuit board and method for manufacturing the sameCHOI JIN WON·Filed 2011·Application pending·0 cites
- 4537US2010095159A1Apparatus and method for automatic testing of software or digital devicesJEONG SUNG-WON·Filed 2009·Application pending·0 cites
- 4635US9292524B2File system and file storing methodSAMSUNG ELECTRONICS CO LTD·Filed 2012·Granted Mar 22, 2016·0 cites·14 claims
- 4735US2014101583A1Mobile terminals and methods of operating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Application pending·0 cites
- 4835US2011014826A1Lead pin for package substrateSAMSUNG ELECTRO MECH·Filed 2010·Application pending·0 cites
- 4934US2016021736A1Printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2015·Application pending·0 cites
- 5034US2016081195A1Detach core substrate and method for manufacturing thereofSAMSUNG ELECTRO MECH·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →