Inventor · disambiguated record
Shigefumi Okada
Also filed as: OKADA SHIGEFUMI
5 granted patents·1 pending application·13 citations·filing 2012–2021
69Inventor score
Top patents by PatentIndex Score
6 records- 0183US8652941B2Wafer dicing employing edge region underfill removalINDYK RICHARD F·Filed 2012·Granted Feb 18, 2014·10 cites·25 claims
- 0277US9390958B2Transfer unit including suction openings configured to receive suction pads or seal members thereinDISCO CORP·Filed 2015·Granted Jul 12, 2016·3 cites·7 claims
- 0349US2015001714A1Stress-resilient chip structure and dicing processIBM·Filed 2014·Application pending·0 cites
- 0446US10211175B2Stress-resilient chip structure and dicing processIBM·Filed 2012·Granted Feb 19, 2019·0 cites·13 claims
- 0544US11456260B2Wafer processing methodDISCO CORP·Filed 2021·Granted Sep 27, 2022·0 cites·12 claims
- 0636US9034735B2Laser processing method for workpieceDISCO CORP·Filed 2013·Granted May 19, 2015·0 cites·9 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →