Inventor · disambiguated record
Masatoshi Suehiro
Also filed as: SUEHIRO MASATOSHI
9 granted patents·407 citations·filing 1988–1999
92Inventor score
Files withMATSUSHITA ELECTRIC INDUSTRIAL CO LTD4DAI ICHI KOGYO SEIYAKU CO LTD2DIA ICHI KOGYO SEIYAKU CO LTD1KYOTO ELEX CO LTD1SUEHIRO MASATOSHI1
Top patents by PatentIndex Score
9 records- 0192US5652042AConductive paste compound for via hole filling, printed circuit board which uses the conductive pasteMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1994·Granted Jul 29, 1997·111 cites·15 claims
- 0286US5977490AConductive paste compound for via hole filling, printed circuit board which uses the conductive paste, and method of manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1997·Granted Nov 2, 1999·66 cites·4 claims
- 0381US5914358AConductive paste compound for via hole filling, printed circuit board which uses the conductive paste, and method of manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1996·Granted Jun 22, 1999·49 cites·10 claims
- 0473US5733467AConductive paste compound for via hole filling, printed circuit board which uses the conductive paste, and method of manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1997·Granted Mar 31, 1998·33 cites·21 claims
- 0572US6080336AVia-filling conductive paste compositionKYOTO ELEX CO LTD·Filed 1999·Granted Jun 27, 2000·43 cites·4 claims
- 0671US5035837ACopper paste compositionDIA ICHI KOGYO SEIYAKU CO LTD·Filed 1990·Granted Jul 30, 1991·37 cites·16 claims
- 0764US4937016ACopper conductor compositionDAI ICHI KOGYO SEIYAKU CO LTD·Filed 1989·Granted Jun 26, 1990·25 cites·3 claims
- 0861US4865772ACopper thick film conductor compositionSUEHIRO MASATOSHI·Filed 1988·Granted Sep 12, 1989·23 cites·8 claims
- 0954US4906404ACopper conductor compositionDAI ICHI KOGYO SEIYAKU CO LTD·Filed 1988·Granted Mar 6, 1990·20 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →