Inventor · disambiguated record
Shuhei Murata
Also filed as: MURATA SHUHEI
13 granted patents·12 pending applications·46 citations·filing 1977–2022
86Inventor score
Files withJX NIPPON MINING & METALS CORP10MURATA SHUHEI4NIPPON SHEET GLASS CO LTD2NITTO DENKO CORP2FUTASE TAKUYA1
Top patents by PatentIndex Score
25 records- 0190US7923319B2Method for manufacturing a semiconductor integrated circuit device circuit deviceRENESAS ELECTRONICS CORP·Filed 2009·Granted Apr 12, 2011·15 cites·17 claims
- 0275US12180577B2Titanium sputtering target, production method therefor, and method for producing titanium-containing thin filmJX NIPPON MINING & METALS CORP·Filed 2022·Granted Dec 31, 2024·0 cites·20 claims
- 0371US8278151B2Tape for holding chip, method of holding chip-shaped workpiece, method of manufacturing semiconductor device using tape for holding chip, and method of manufacturing tape for holding chipMURATA SHUHEI·Filed 2010·Granted Oct 2, 2012·3 cites·4 claims
- 0469US8268682B2Method for manufacturing a semiconductor integrated circuit deviceFUTASE TAKUYA·Filed 2011·Granted Sep 18, 2012·2 cites·8 claims
- 0567US4073299AThree-dimensional embroidered article and the method for the production of the sameMURATA SHUHEI·Filed 1977·Granted Feb 14, 1978·26 cites·3 claims
- 0665US10894740B2Method for producing glass sheet and glass sheetNIPPON SHEET GLASS CO LTD·Filed 2019·Granted Jan 19, 2021·0 cites·6 claims
- 0765US10685820B2Monocrystalline silicon sputtering targetJX NIPPON MINING & METALS CORP·Filed 2018·Granted Jun 16, 2020·0 cites·17 claims
- 0862US12234544B2Sputtering target and method for producing sputtering targetJX ADVANCED METALS CORP·Filed 2022·Granted Feb 25, 2025·0 cites·16 claims
- 0962US2020240005A1Titanium Sputtering Target, Production Method Therefor, And Method For Producing Titanium-Containing Thin FilmJX NIPPON MINING & METALS CORP·Filed 2018·Application pending·0 cites
- 1060US10984992B2Sputtering targetJX NIPPON MINING & METALS CORP·Filed 2016·Granted Apr 20, 2021·0 cites·17 claims
- 1155US11193199B2Sputtering target capable of stabilizing ignitionJX NIPPON MINING & METALS CORP·Filed 2017·Granted Dec 7, 2021·0 cites·6 claims
- 1255US10513458B2Method for producing glass sheet and glass sheetNIPPON SHEET GLASS CO LTD·Filed 2014·Granted Dec 24, 2019·0 cites·7 claims
- 1354US12054822B2Sputtering target product and method for producing recycled sputtering target productJX NIPPON MINING & METALS CORP·Filed 2020·Granted Aug 6, 2024·0 cites·16 claims
- 1452US8420247B2Crosslinking polymer-supported porous film for battery separator and use thereofTAKE HIROYOSHI·Filed 2008·Granted Apr 16, 2013·0 cites·13 claims
- 1552US2010325877A1Porous film having reactive polymer layer thereon for use in battery separator, and use of the porous filmNITTO DENKO CORP·Filed 2008·Application pending·0 cites
- 1650US2022033960A1Sputtering Target and Method for Producing SameJX NIPPON MINING & METALS CORP·Filed 2019·Application pending·0 cites
- 1749US2022049346A1Sputtering Target and Method for Producing SameJX NIPPON MINING & METALS CORP·Filed 2019·Application pending·0 cites
- 1848US2021010149A1Co Anode, And Co Electroplating Method Using Co AnodeJX NIPPON MINING & METALS CORP·Filed 2018·Application pending·0 cites
- 1946US2013273361A1Active Energy Ray-Curable Pressure-Sensitive Adhesive for Re-Release and Dicing Die-Bonding FilmNITTO DENKO CORP·Filed 2013·Application pending·0 cites
- 2045US2012107576A1Tape for holding chip, method of holding chip-shaped workpiece, method of manufacturing semiconductor device using tape for holding chip, and method of manufacturing tape for holding chipMURATA SHUHEI·Filed 2012·Application pending·0 cites
- 2143US2021040601A1Sputtering Target and Method for Producing Sputtering TargetJX NIPPON MINING & METALS CORP·Filed 2019·Application pending·0 cites
- 2240US2013302599A1Anti-fog coated articleOYA KAZUAKI·Filed 2011·Application pending·0 cites
- 2340US2012003470A1Active energy ray-curable pressure-sensitive adhesive for re-release and dicing die-bonding filmKAMIYA KATSUHIKO·Filed 2011·Application pending·0 cites
- 2436US2012070960A1Dicing die bond film, method of manufacturing dicing die bond film, and method of manufacturing semiconductor deviceMURATA SHUHEI·Filed 2011·Application pending·0 cites
- 2531US2011217501A1Dicing die-bonding filmSHISHIDO YUICHIRO·Filed 2011·Application pending·0 cites
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