Inventor · disambiguated record
Khai Huat Jeffrey Low
Also filed as: LOW KHAI HUAT JEFFREY
7 granted patents·13 citations·filing 2007–2015
79Inventor score
Technology areasH10W
Top patents by PatentIndex Score
7 records- 0177US8237268B2Module comprising a semiconductor chipOTREMBA RALF·Filed 2007·Granted Aug 7, 2012·6 cites·29 claims
- 0272US9123526B2Module comprising a semiconductor chipINFINEON TECHNOLOGIES AG·Filed 2013·Granted Sep 1, 2015·2 cites·17 claims
- 0359US8067841B2Semiconductor devices having a resin with warpage compensated surfacesHENG CHAI WEI·Filed 2008·Granted Nov 29, 2011·3 cites·25 claims
- 0452US9379046B2Module comprising a semiconductor chipINFINEON TECHNOLOGIES AG·Filed 2015·Granted Jun 28, 2016·0 cites·19 claims
- 0552US8633102B2Module comprising a semiconductor chipOTREMBA RALF·Filed 2012·Granted Jan 21, 2014·0 cites·20 claims
- 0652US8207601B2Electronic component and a method of fabricating an electronic componentLOW KHAI HUAT JEFFREY·Filed 2008·Granted Jun 26, 2012·2 cites·20 claims
- 0746US8377753B2Method of fabricating a semiconductor device having a resin with warpage compensated structuresINFINEON TECHNOLOGIES AG·Filed 2011·Granted Feb 19, 2013·0 cites·29 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →