Inventor · disambiguated record
Gareth G. Hougham
Also filed as: HOUGHAM GARETH · HOUGHAM GARETH G · HOUGHAM GARETH GEOFFREY
110 granted patents·10 pending applications·1,297 citations·filing 1988–2015
99Inventor score
Top patents by PatentIndex Score
120 records- 0198US7331796B2Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometriesIBM·Filed 2006·Granted Feb 19, 2008·50 cites·7 claims
- 0297US7832095B2Method of forming a land grid array (LGA) interposer arrangement utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometriesIBM·Filed 2008·Granted Nov 16, 2010·24 cites·3 claims
- 0397US7276787B2Silicon chip carrier with conductive through-vias and method for fabricating sameIBM·Filed 2003·Granted Oct 2, 2007·124 cites·8 claims
- 0496US7736152B2Land grid array fabrication using elastomer core and conducting metal shell or meshIBM·Filed 2008·Granted Jun 15, 2010·37 cites·1 claims
- 0596US7665999B2Land grid array (LGA) interposer structure of a moldable dielectric polymer providing for electrical contacts on opposite sides of a carrier planeIBM·Filed 2008·Granted Feb 23, 2010·19 cites·3 claims
- 0696US7354277B2Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometriesIBM·Filed 2007·Granted Apr 8, 2008·20 cites·4 claims
- 0796US6656308B2Process of fabricating a precision microcontact printing stampIBM·Filed 2002·Granted Dec 2, 2003·74 cites·19 claims
- 0895US7836585B2Method of operatively combining a plurality of components to form a land grip array interposer (LGA) structure utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometriesIBM·Filed 2008·Granted Nov 23, 2010·16 cites·3 claims
- 0995US7832094B2Method of operatively combining a plurality of components to form a land grip array interposer (LGA) structure utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometriesIBM·Filed 2008·Granted Nov 16, 2010·16 cites·5 claims
- 1095US7823283B2Method of forming a land grid array interposerIBM·Filed 2008·Granted Nov 2, 2010·16 cites·8 claims
- 1195US7484966B2Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometriesIBM·Filed 2007·Granted Feb 3, 2009·16 cites·1 claims
- 1295US7361025B2Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometriesIBM·Filed 2007·Granted Apr 22, 2008·16 cites·6 claims
- 1395US6665033B2Method for forming alignment layer by ion beam surface modificationIBM·Filed 2000·Granted Dec 16, 2003·63 cites·6 claims
- 1493US8037600B2Method of producing a land grid array interposer structureIBM·Filed 2008·Granted Oct 18, 2011·11 cites·7 claims
- 1593US7351360B2Self orienting micro plates of thermally conducting material as component in thermal paste or adhesiveIBM·Filed 2004·Granted Apr 1, 2008·33 cites·15 claims
- 1690US7452212B2Metalized elastomeric electrical contactsIBM·Filed 2005·Granted Nov 18, 2008·16 cites·1 claims
- 1790US5987890AElectronic component cooling using a heat transfer buffering capabilityINT BUSINESS MACHINES COMPANY·Filed 1998·Granted Nov 23, 1999·115 cites·15 claims
- 1888US8604623B2Self orienting micro plates of thermally conducting material as component in thermal paste or adhesiveHOUGHAM GARETH·Filed 2012·Granted Dec 10, 2013·4 cites·15 claims
- 1988US7473102B2Space transforming land grid array interposersIBM·Filed 2006·Granted Jan 6, 2009·16 cites·14 claims
- 2087US7452568B2Centrifugal method for filing high aspect ratio blind micro vias with powdered materials for circuit formationIBM·Filed 2005·Granted Nov 18, 2008·15 cites·1 claims
- 2186US7658616B2Groups of land grid interposers of different heights having metal-on elastomer hemi-torus shapes providing for electrical contact with at least one component on an opposite side of an electrically insulating carrier plate mounting interposersIBM·Filed 2008·Granted Feb 9, 2010·5 cites·1 claims
- 2286US7137827B2Interposer with electrical contact button and methodIBM·Filed 2003·Granted Nov 21, 2006·32 cites·1 claims
- 2385US6783717B2Process of fabricating a precision microcontact printing stampIBM·Filed 2002·Granted Aug 31, 2004·23 cites·12 claims
- 2484US7467951B2Land grid array (LGA) interposer utilizing metal-on-elastomer hemi torus and other multiple points of contact geometriesIBM·Filed 2007·Granted Dec 23, 2008·4 cites·4 claims
- 2583US7863091B2Planar array contact memory cardsIBM·Filed 2008·Granted Jan 4, 2011·9 cites·10 claims
- 2682US5324813ALow dielectric constant fluorinated polymers and methods of fabrication thereofIBM·Filed 1992·Granted Jun 28, 1994·27 cites·35 claims
- 2781US8846191B2Thermal expansion control employing platelet fillersIBM·Filed 2012·Granted Sep 30, 2014·2 cites·19 claims
- 2881US7374428B2Land Grid Array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometriesIBM·Filed 2007·Granted May 20, 2008·3 cites·4 claims
- 2981US7361026B2Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometriesIBM·Filed 2007·Granted Apr 22, 2008·3 cites·6 claims
- 3080US9565759B2Axiocentric scrubbing land grid array contacts and methods for fabricationGLOBALFOUNDRIES INC·Filed 2015·Granted Feb 7, 2017·2 cites·3 claims
- 3180US8651877B2Metallurgical clamshell methods for micro land grid array fabricationHOUGHAM GARETH·Filed 2012·Granted Feb 18, 2014·4 cites·7 claims
- 3280US8263879B2Axiocentric scrubbing land grid array contacts and methods for fabricationHOUGHAM GARETH·Filed 2009·Granted Sep 11, 2012·14 cites·7 claims
- 3380US7322844B1Pin grid array zero insertion force connectors configurable for supporting large pin countsIBM·Filed 2006·Granted Jan 29, 2008·8 cites·18 claims
- 3479US8449971B2Thermal expansion control employing platelet fillersHOUGHAM GARETH G·Filed 2011·Granted May 28, 2013·2 cites·24 claims
- 3578US7776993B2Underfilling with acid-cleavable acetal and ketal epoxy oligomersIBM·Filed 2005·Granted Aug 17, 2010·8 cites·13 claims
- 3678US7006193B2Method of sealing two substrates with a non-epoxy or epoxy-acrylate sealant using laser radiationAU OPTRONICS CORP·Filed 2001·Granted Feb 28, 2006·16 cites·11 claims
- 3777US8191245B2Method of forming a land grid array (LGA) interposerHOUGHAM GARETH G·Filed 2008·Granted Jun 5, 2012·2 cites·18 claims
- 3877US8174106B2Through board stacking of multiple LGA-connected componentsCOTEUS PAUL W·Filed 2006·Granted May 8, 2012·6 cites·20 claims
- 3977US7648369B2Interposer with electrical contact button and methodIBM·Filed 2006·Granted Jan 19, 2010·5 cites·5 claims
- 4077US7491067B2Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometriesIBM·Filed 2007·Granted Feb 17, 2009·2 cites·5 claims
- 4177US7488182B2Land grid array (LGA) interposer structure providing for electrical contacts on opposite sides of a carrier planeIBM·Filed 2007·Granted Feb 10, 2009·2 cites·4 claims
- 4277US7402053B2Pin grid array zero insertion force connectors configurable for supporting large pin countsIBM·Filed 2007·Granted Jul 22, 2008·6 cites·18 claims
- 4377US7402052B2Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometriesIBM·Filed 2007·Granted Jul 22, 2008·2 cites·5 claims
- 4477US7381063B2Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometriesIBM·Filed 2007·Granted Jun 3, 2008·2 cites·4 claims
- 4577US6919420B2Acid-cleavable acetal and ketal based epoxy oligomersIBM·Filed 2002·Granted Jul 19, 2005·21 cites·23 claims
- 4677US6109039AHeat transfer in electronic apparatusIBM·Filed 1999·Granted Aug 29, 2000·79 cites·15 claims
- 4776US6179679B1Method and system for curing ultra violet curable sealant that is shadowed by metallizationIBM·Filed 1999·Granted Jan 30, 2001·50 cites·13 claims
- 4875US8268282B2Self orienting micro plates of thermally conducting material as component in thermal paste or adhesiveHOUGHAM GARETH·Filed 2007·Granted Sep 18, 2012·4 cites·12 claims
- 4975US7417315B2Negative thermal expansion system (NTEs) device for TCE compensation in elastomer composites and conductive elastomer interconnects in microelectronic packagingIBM·Filed 2002·Granted Aug 26, 2008·12 cites·30 claims
- 5074US7771208B2Metalized elastomeric electrical contactsIBM·Filed 2008·Granted Aug 10, 2010·5 cites·34 claims
Showing the top 50 of 120 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →