Inventor · disambiguated record
Soon Jin Cho
Also filed as: CHO SOON · CHO SOON JIN
13 granted patents·17 pending applications·399 citations·filing 1999–2014
92Inventor score
Top patents by PatentIndex Score
30 records- 0195US6222259B1Stack package and method of fabricating the sameHYUNDAI ELECTRONICS IND·Filed 1999·Granted Apr 24, 2001·234 cites·12 claims
- 0293US7875340B2Heat radiation substrate having metal core and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2007·Granted Jan 25, 2011·25 cites·5 claims
- 0392US6400021B1Wafer level package and method for fabricating the sameHYUNDAI ELECTRONICS IND·Filed 2000·Granted Jun 4, 2002·93 cites·5 claims
- 0486US7517730B2Coreless substrate and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2006·Granted Apr 14, 2009·12 cites·10 claims
- 0583US7981728B2Coreless substrateSAMSUNG ELECTRO MECH·Filed 2009·Granted Jul 19, 2011·11 cites·6 claims
- 0681US8558360B2Flip chip package and method of manufacturing the sameKIM EY YONG·Filed 2010·Granted Oct 15, 2013·9 cites·15 claims
- 0776US8445790B2Coreless substrate having filled via pad and method of manufacturing the sameLEE SEOK KYU·Filed 2009·Granted May 21, 2013·8 cites·4 claims
- 0874US8061025B2Method of manufacturing heat radiation substrate having metal coreCHO SEUNG HYUN·Filed 2010·Granted Nov 22, 2011·2 cites·5 claims
- 0959US8834077B2Micro drill and method of fabricating the sameYOON TAE SIK·Filed 2009·Granted Sep 16, 2014·3 cites·5 claims
- 1057US8535547B2Printed circuit board manufacturing system and manufacturing method thereofCHO CHUNG-WOO·Filed 2008·Granted Sep 17, 2013·2 cites·2 claims
- 1155US2013243941A1Method of manufacturing coreless substrate having filled via padSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 1251US8809122B2Method of manufacturing flip chip packageSAMSUNG ELECTRO MECH·Filed 2013·Granted Aug 19, 2014·0 cites·15 claims
- 1349US8074352B2Method of manufacturing printed circuit boardPARK DONG-JIN·Filed 2008·Granted Dec 13, 2011·0 cites·3 claims
- 1448US2009136656A1Method of manufacturing printed circuit boardSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 1547US2009025581A1Mask for screen printing and screen printing method using the sameSAMSUNG ELECTRO MECH·Filed 2007·Application pending·0 cites
- 1647US2011138616A1Printed circuit board manufacturing systemSAMSUNG ELECTRO MECH·Filed 2011·Application pending·0 cites
- 1746US7736952B2Wafer packaging methodSAMSUNG ELECTRO MECH·Filed 2008·Granted Jun 15, 2010·0 cites·8 claims
- 1846US2009027864A1Printed circuit board and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 1946US2010271792A1Electronic component package and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 2045US2011097553A1Trench substrate and method of fabricating the sameHONG JONG KUK·Filed 2009·Application pending·0 cites
- 2144US2008225501A1Printed circuit board and manufacturing method thereofCHO CHUNG-WOO·Filed 2008·Application pending·0 cites
- 2243US2014347834A1Electronic component embedded printed circuit board and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 2342US2007018335A1Polygonal, rounded, and circular flip chip ball grid array boardSAMSUNG ELECTRO MECH·Filed 2006·Application pending·0 cites
- 2442US2015250050A1Embedded board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 2542US2014186581A1Primer-coated copper foil having superior adhesive strength and method for producing the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 2641US2014153204A1Electronic component embedded printing circuit board and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 2739US2014185254A1Printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 2836US2015118603A1Photo mask and method of manufacturing the same, and method of forming trenches by using photo maskSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 2935US2014117426A1Semiconductor device and method for fabricating the sameCHO SOON·Filed 2013·Application pending·0 cites
- 3033US2014126166A1Method of forming solder resist post, method of manufacturing electronic device package usong solder resist post, and electronic device package manufactured by using methodsSAMSUNG ELECTRO MECH·Filed 2012·Application pending·0 cites
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