Inventor · disambiguated record
Myeong-Soon Park
Also filed as: PARK MYEONG SOON
15 granted patents·13 pending applications·69 citations·filing 2005–2021
91Inventor score
Top patents by PatentIndex Score
28 records- 0193US10008462B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Jun 26, 2018·12 cites·9 claims
- 0289US10840159B2Semiconductor chip including chip pad, redistribution wiring test pad, and redistribution wiring connection padSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Nov 17, 2020·5 cites·16 claims
- 0385US7205660B2Wafer level chip scale package having a gap and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Apr 17, 2007·12 cites·10 claims
- 0482US7545027B2Wafer level package having redistribution interconnection layer and method of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Jun 9, 2009·11 cites·22 claims
- 0581US7875552B2Methods of forming integrated circuit chips having vertically extended through-substrate vias therein and chips formed therebySAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Jan 25, 2011·7 cites·5 claims
- 0676US7312143B2Wafer level chip scale package having a gap and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Dec 25, 2007·6 cites·10 claims
- 0775US8629059B2Methods of forming integrated circuit chips having vertically extended through-substrate vias thereinLEE HO-JIN·Filed 2010·Granted Jan 14, 2014·3 cites·18 claims
- 0873US9859204B2Semiconductor devices with redistribution padsSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Jan 2, 2018·2 cites·18 claims
- 0972US11705376B2Semiconductor chip including chip pad, redistribution wiring test pad, and redistribution wiring connection padSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jul 18, 2023·0 cites·20 claims
- 1070US8431479B2Semiconductor devices having redistribution structures and packages, and methods of forming the sameKIM KI-HYUK·Filed 2010·Granted Apr 30, 2013·4 cites·23 claims
- 1167US11189535B2Semiconductor chip including chip pad, redistribution wiring test pad, and redistribution wiring connection padSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Nov 30, 2021·0 cites·17 claims
- 1265US9219035B2Integrated circuit chips having vertically extended through-substrate vias thereinLEE HO-JIN·Filed 2014·Granted Dec 22, 2015·1 cites·8 claims
- 1364US8193637B2Semiconductor package and multi-chip package using the samePARK MYEONG-SOON·Filed 2008·Granted Jun 5, 2012·4 cites·25 claims
- 1462US7638365B2Stacked chip package and method for forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Dec 29, 2009·2 cites·29 claims
- 1544US9960112B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted May 1, 2018·0 cites·19 claims
- 1644US2008128888A1System-in-package (SiP) and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 1743US2008122116A1Method of forming metal layer wiring structure on backside of wafer, metal layer wiring structure formed using the method, method of stacking chip package, and chip package stack structure formed using the methodSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 1843US2007164431A1Wafer level chip scale package having rerouting layer and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 1943US2006019467A1Methods of fabricating integrated circuit chips for multi-chip packaging and wafers and chips formed therebyLEE IN-YOUNG·Filed 2005·Application pending·0 cites
- 2042US2007069320A1Wiring structure of a semiconductor package and method of manufacturing the same, and wafer level package having the wiring structure and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 2140US2006038291A1Electrode structure of a semiconductor device and method of manufacturing the sameCHUNG HYUN-SOO·Filed 2005·Application pending·0 cites
- 2236US2006073704A1Method of forming bump that may reduce possibility of losing contact pad materialJEONG SE-YOUNG·Filed 2005·Application pending·0 cites
- 2336US2017025384A1Semiconductor chip and semiconductor package having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Application pending·0 cites
- 2435US2017103958A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2016·Application pending·0 cites
- 2534US2016005707A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Application pending·0 cites
- 2632US2010190333A1Method of forming connection terminalSAMSUNG ELECTRONICS CO LTD·Filed 2010·Application pending·0 cites
- 2730US2012031953A1Apparatus for bump reflow and methods of forming bumps using the samePARK MYEONG SOON·Filed 2011·Application pending·0 cites
- 2830US2016351472A1Integrated circuit device and method of manufacturing the samePARK MYEONG-SOON·Filed 2016·Application pending·0 cites
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