Inventor · disambiguated record
Tae-Hyo Ro
Also filed as: RO TAE-HYO
4 granted patents·20 citations·filing 1997–2001
71Inventor score
Files withSAMSUNG ELECTRONICS CO LTD3
Top patents by PatentIndex Score
4 records- 0142US6303999B1Interconnect structure with a passivation layer and chip padSAMSUNG ELECTRONICS CO LTD·Filed 1998·Granted Oct 16, 2001·12 cites·12 claims
- 0233US6596633B2Method for manufacturing a semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Jul 22, 2003·0 cites·10 claims
- 0329US5945682ASpace-saving ion-implantation system installed both in and adjacent to a semiconductor manufacturing lineSAMSUNG ELECTRONICS CO LTD·Filed 1997·Granted Aug 31, 1999·4 cites·5 claims
- 0428US6825482B1Ion implantation system for manufacturing semiconductor deviceFiled 1997·Granted Nov 30, 2004·4 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →