Inventor · disambiguated record
Carsten Nieland
Also filed as: NIELAND CARSTEN
12 granted patents·5 pending applications·29 citations·filing 2010–2022
85Inventor score
Files withLINXENS HOLDING9SMARTRAC TECH GMBH5SMARTRAC IP BV1SMARTRAC TECHNOLOGY1SMARTRAC TECHNOLOGY GMBH1
Top patents by PatentIndex Score
17 records- 0182US10552725B2Transponder apparatusSMARTRAC TECH GMBH·Filed 2016·Granted Feb 4, 2020·8 cites·20 claims
- 0281US9215809B2Contact bumps methods of making contact bumpsSMARTRAC TECHNOLOGY GMBH·Filed 2013·Granted Dec 15, 2015·10 cites·22 claims
- 0375US8342402B2RFID electronic labelSMARTRAC TECHNOLOGY·Filed 2010·Granted Jan 1, 2013·9 cites·24 claims
- 0462US9978643B2Method of separating chips from a waferSMARTRAC TECH GMBH·Filed 2014·Granted May 22, 2018·1 cites·12 claims
- 0560US12248833B2Module for integrating into a card body of a smart card, smart card, and method of implanting a module into a card body of a smart cardLINXENS HOLDING·Filed 2021·Granted Mar 11, 2025·0 cites·19 claims
- 0659US11760061B2Laminated foil structure and method of forming the sameLINXENS HOLDING·Filed 2020·Granted Sep 19, 2023·0 cites·9 claims
- 0757US12296573B2Pre-package for a smartcard, a smartcard and a method of forming the sameLINXENS HOLDING·Filed 2020·Granted May 13, 2025·0 cites·20 claims
- 0857US10292270B2Contact bump connection and contact bump and method for producing a contact bump connectionSMARTRAC TECH GMBH·Filed 2013·Granted May 14, 2019·1 cites·7 claims
- 0951US12131987B2Biometric sensor module for a smart card and method for manufacturing such a moduleLINXENS HOLDING·Filed 2020·Granted Oct 29, 2024·0 cites·15 claims
- 1050US12217114B2Lead-frame, card body of a smart card, smart card, and method of forming a smart cardLINXENS HOLDING·Filed 2022·Granted Feb 4, 2025·0 cites·19 claims
- 1149US12406167B2Wire pad design of a connection pad in a prelam body of a smart card, prelam body, smart card, method of forming a wire pad design, and method of forming a smart cardLINXENS HOLDING·Filed 2021·Granted Sep 2, 2025·0 cites·23 claims
- 1249US2018261506A1Method for Separating Chips from a WaferSMARTRAC TECH GMBH·Filed 2018·Application pending·0 cites
- 1343US2024412027A1Dual interface electronic module with value-add component and manufacturing method thereofLINXENS HOLDING·Filed 2021·Application pending·0 cites
- 1440US12033016B2Method of forming a prelam body of a smart card, a method of forming a smart card, a prelam body, and a smart cardLINXENS HOLDING·Filed 2020·Granted Jul 9, 2024·0 cites·29 claims
- 1540US2021133529A1Chip Card and Method for Fabricating a Chip CardLINXENS HOLDING·Filed 2018·Application pending·0 cites
- 1637US2015356395A1Transponder Layer and Method for Producing SameSMARTRAC IP BV·Filed 2013·Application pending·0 cites
- 1731US2016233188A1Contact bumps methods of making contact bumpsSMARTRAC TECH GMBH·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →