Inventor · disambiguated record
Hiroki Hosaka
Also filed as: HOSAKA HIROKI
30 granted patents·9 pending applications·200 citations·filing 1995–2024
96Inventor score
Top patents by PatentIndex Score
39 records- 0192USD793438SDisplay screen with transitional graphical user interfaceNIKON CORP·Filed 2014·Granted Aug 1, 2017·49 cites·1 claims
- 0285US8149313B2Photographic apparatus, setting method of photography conditions, and recording mediumWATANABE MAKOTO·Filed 2009·Granted Apr 3, 2012·9 cites·9 claims
- 0384US7457680B2Conveyance method for transporting objectsTOKYO ELECTRON LTD·Filed 2006·Granted Nov 25, 2008·10 cites·4 claims
- 0481US7583096B2Probing apparatus and probing methodTOKYO ELECTRON LTD·Filed 2007·Granted Sep 1, 2009·6 cites·11 claims
- 0575USD783043SDisplay screen with transitional graphical user interfaceNIKON CORP·Filed 2014·Granted Apr 4, 2017·19 cites·1 claims
- 0675USD777775SDisplay screen with a graphical user interfaceNIKON CORP·Filed 2015·Granted Jan 31, 2017·16 cites·1 claims
- 0775US7458469B2Substrate transfer apparatus and method, and storage mediumTOKYO ELECTRON LTD·Filed 2005·Granted Dec 2, 2008·5 cites·12 claims
- 0872USD826271SDisplay screen with transitional graphical user interfaceNIKON CORP·Filed 2017·Granted Aug 21, 2018·13 cites·1 claims
- 0972US7283890B2Work convey system, unmanned convey vehicle system, unmanned convey vehicle, and work convey methodTOKYO ELECTRON LTD·Filed 2002·Granted Oct 16, 2007·15 cites·6 claims
- 1069US7153087B2Centering mechanism, centering unit, semiconductor manufacturing apparatus, and centering methodTOKYO ELECTRON LTD·Filed 2003·Granted Dec 26, 2006·12 cites·9 claims
- 1168US10006961B2Transfer method and inspection systemTOKYO ELECTRON LTD·Filed 2015·Granted Jun 26, 2018·1 cites·16 claims
- 1266US2024312696A1Electronic componentTDK CORP·Filed 2024·Application pending·0 cites
- 1366US2024312695A1Electronic componentTDK CORP·Filed 2024·Application pending·0 cites
- 1466US2025111969A1Electronic componentTDK CORP·Filed 2024·Application pending·0 cites
- 1565US7887280B2Processing apparatusTOKYO ELECTRON LTD·Filed 2007·Granted Feb 15, 2011·2 cites·23 claims
- 1662US10389359B1Buffer circuitMICRON TECHNOLOGY INC·Filed 2018·Granted Aug 20, 2019·1 cites·20 claims
- 1762US2024312684A1Coil componentTDK CORP·Filed 2024·Application pending·0 cites
- 1860US12106997B2Test device, change kit, and method of exchanging change kitTOKYO ELECTRON LTD·Filed 2021·Granted Oct 1, 2024·0 cites·8 claims
- 1960US10855282B2Buffer circuitMICRON TECHNOLOGY INC·Filed 2019·Granted Dec 1, 2020·0 cites·19 claims
- 2057US2025226024A1Semiconductor deviceMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 2154US11640969B2Compensation capacitors layout in semiconductor deviceMICRON TECHNOLOGY INC·Filed 2021·Granted May 2, 2023·0 cites·18 claims
- 2254USD559805SStage arm for a semiconductor wafer delivery apparatusTOKYO ELECTRON LTD·Filed 2005·Granted Jan 15, 2008·9 cites·1 claims
- 2351US12033945B2Microelectronic device interface configurations, and associated methods, devices, and systemsMICRON TECHNOLOGY INC·Filed 2020·Granted Jul 9, 2024·0 cites·19 claims
- 2451US11515175B2Wafer inspection apparatusTOKYO ELECTRON LTD·Filed 2018·Granted Nov 29, 2022·0 cites·9 claims
- 2551US11486924B2Inspection apparatusTOKYO ELECTRON LTD·Filed 2021·Granted Nov 1, 2022·0 cites·6 claims
- 2650US10910358B2Integrated assemblies having capacitive units, and having resistive structures coupled with the capacitive unitsMICRON TECHNOLOGY INC·Filed 2019·Granted Feb 2, 2021·0 cites·25 claims
- 2750US8310261B2Probing apparatus and probing methodHOSAKA HIROKI·Filed 2009·Granted Nov 13, 2012·0 cites·20 claims
- 2850US5801527AApparatus and method for testing semiconductor deviceTOKYO ELECTRON LTD·Filed 1995·Granted Sep 1, 1998·16 cites·15 claims
- 2947USD592230SWafer carrying-in/out machineTOKYO ELECTRON LTD·Filed 2007·Granted May 12, 2009·6 cites·1 claims
- 3047US2005209725A1Conveyance system, conveyance method and vacuum holding apparatus for object to be processed, and centering method for waferAKIYAMA SHUJI·Filed 2005·Application pending·0 cites
- 3141USD571740SSemiconductor wafer delivery apparatusTOKYO ELECTRON LTD·Filed 2005·Granted Jun 24, 2008·4 cites·1 claims
- 3239USD607424SWafer carrying-in/out apparatusTOKYO ELECTRON LTD·Filed 2006·Granted Jan 5, 2010·3 cites·1 claims
- 3339US2004046545A1Conveyance system, conveyance method and vacuum holding apparatus for object to be processed, and centering method for waterFiled 2001·Application pending·0 cites
- 3435USD571739SSemiconductor wafer delivery apparatusTOKYO ELECTRON LTD·Filed 2005·Granted Jun 24, 2008·2 cites·1 claims
- 3535US2013195587A1Wafer transfer deviceHOSAKA HIROKI·Filed 2012·Application pending·0 cites
- 3634USD559806SPair of stage arms for a semiconductor wafer delivery apparatusTOKYO ELECTRON LTD·Filed 2005·Granted Jan 15, 2008·2 cites·1 claims
- 3732US2012300259A1Information adding device, electronic camera, information adding programHOSAKA HIROKI·Filed 2011·Application pending·0 cites
- 3830USD602882SWafer carrying-in/out apparatusTOKYO ELECTRON LTD·Filed 2008·Granted Oct 27, 2009·0 cites·1 claims
- 3930USD568837SSemiconductor wafer delivery apparatusTOKYO ELECTRON LTD·Filed 2005·Granted May 13, 2008·0 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →