Inventor · disambiguated record

Daesuk Lee

Also filed as: LEE DAESUK

3 granted patents·3 citations·filing 2020–2022

53Inventor score

Technology areasH10W

Files withSAMSUNG ELECTRONICS CO LTD3

Top patents by PatentIndex Score

3 records

0190US11380606B2Semiconductor device including via structure with head and body portionsSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jul 5, 2022·3 cites·18 claims
0266US11798866B2Semiconductor device including via structures with undercut portions and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Oct 24, 2023·0 cites·20 claims
0349US11373932B2Semiconductor packages including through holes and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jun 28, 2022·0 cites·19 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →