Inventor · disambiguated record
Han-Chee Yen
Also filed as: YEN HAN-CHEE
10 granted patents·3 pending applications·141 citations·filing 2012–2023
87Inventor score
Technology areasH10W
Top patents by PatentIndex Score
13 records- 0195US8786060B2Semiconductor package integrated with conformal shield and antennaYEN HAN-CHEE·Filed 2012·Granted Jul 22, 2014·93 cites·18 claims
- 0292US9129954B2Semiconductor package including antenna layer and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2013·Granted Sep 8, 2015·22 cites·21 claims
- 0384US9153542B2Semiconductor package having an antenna and manufacturing method thereofLIN I-CHIA·Filed 2012·Granted Oct 6, 2015·14 cites·17 claims
- 0480US9978688B2Semiconductor package having a waveguide antenna and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2013·Granted May 22, 2018·6 cites·14 claims
- 0579US11848296B2Semiconductor device package comprising power module and passive elementsADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Dec 19, 2023·1 cites·6 claims
- 0678US11664580B2Semiconductor package including antenna substrate and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted May 30, 2023·2 cites·18 claims
- 0775US9837701B2Semiconductor package including antenna substrate and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2013·Granted Dec 5, 2017·3 cites·20 claims
- 0871US2023299462A1Semiconductor package including antenna substrate and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2023·Application pending·0 cites
- 0955US11158596B2Semiconductor device package comprising power module and passive elementsADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Oct 26, 2021·0 cites·26 claims
- 1048US11239178B2Semiconductor package structures and methods of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Feb 1, 2022·0 cites·19 claims
- 1148US2023400648A1Electronic packageADVANCED SEMICONDUCTOR ENG·Filed 2022·Application pending·0 cites
- 1248US2024194609A1Electronic deviceADVANCED SEMICONDUCTOR ENG·Filed 2022·Application pending·0 cites
- 1340US10811763B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2018·Granted Oct 20, 2020·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →