Inventor · disambiguated record
Toni Salminen
Also filed as: SALMINEN TONI
6 granted patents·3 pending applications·35 citations·filing 2014–2025
78Inventor score
Files withINFINEON TECHNOLOGIES AG9
Top patents by PatentIndex Score
9 records- 0192US9681558B2Module with integrated power electronic circuitry and logic circuitryINFINEON TECHNOLOGIES AG·Filed 2014·Granted Jun 13, 2017·24 cites·13 claims
- 0282US9564423B2Power package with integrated magnetic field sensorINFINEON TECHNOLOGIES AG·Filed 2015·Granted Feb 7, 2017·5 cites·17 claims
- 0376US9564578B2Semiconductor package with integrated magnetic field sensorINFINEON TECHNOLOGIES AG·Filed 2015·Granted Feb 7, 2017·3 cites·20 claims
- 0465US10325837B2Molded semiconductor package with C-wing and gull-wing leadsINFINEON TECHNOLOGIES AG·Filed 2017·Granted Jun 18, 2019·2 cites·20 claims
- 0561US10168391B2Multi-functional interconnect module and carrier with multi-functional interconnect module attached theretoINFINEON TECHNOLOGIES AG·Filed 2016·Granted Jan 1, 2019·1 cites·25 claims
- 0657US2025240890A1Method of embedding an embeddable object into a stacked substrate and stacked substrate arrangementINFINEON TECHNOLOGIES AG·Filed 2025·Application pending·0 cites
- 0754US2025293217A1Embedded package with stacked semiconductor diesINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 0850US2024203935A1Method of embedding a bare die in a carrier laminateINFINEON TECHNOLOGIES AG·Filed 2023·Application pending·0 cites
- 0936US10813229B2Electronic module having an electrically insulating structure with material having a low modulus of elasticityINFINEON TECHNOLOGIES AG·Filed 2015·Granted Oct 20, 2020·0 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →