Inventor · disambiguated record
Keiji Tsujita
Also filed as: TSUJITA KEIJI
11 granted patents·1 pending application·111 citations·filing 1993–2015
89Inventor score
Top patents by PatentIndex Score
12 records- 0187US5334561AHigh pressure injection nozzleMATSUI SHIGETOMO·Filed 1993·Granted Aug 2, 1994·49 cites·7 claims
- 0265US9114935B2Plate member conveying apparatus and method of conveying plate memberKUGE MORIMASA·Filed 2011·Granted Aug 25, 2015·2 cites·7 claims
- 0363US9296080B2Glass plate conveying device and beveling apparatus including the sameKUGE MORIMASA·Filed 2011·Granted Mar 29, 2016·2 cites·19 claims
- 0463US8042558B2High-pressure water cleaning systemKAWASAKI HEAVY IND LTD·Filed 2008·Granted Oct 25, 2011·3 cites·19 claims
- 0561US5434112AHigh pressure injection nozzleKAWASAKI HEAVY IND LTD·Filed 1994·Granted Jul 18, 1995·23 cites·7 claims
- 0659US7891066B2Plate material vertical processing lineKAWASAKI PLANT SYSTEMS KABUSHIKI KAISHA·Filed 2004·Granted Feb 22, 2011·11 cites·14 claims
- 0756US10131564B2Glass plate separating apparatusKAWASAKI HEAVY IND LTD·Filed 2015·Granted Nov 20, 2018·1 cites·9 claims
- 0856US9079226B2High-pressure liquid jet cleaner and high-pressure liquid jet cleaning method for cleaning thin film solar cell panelIKE HIDEAKI·Filed 2010·Granted Jul 14, 2015·2 cites·10 claims
- 0955US7878381B2Plate material cutting unit, plate material cutting apparatus equipped with the plate material cutting unit, and plate material cutting system equipped with the plate material cutting apparatusCORNING JAPAN·Filed 2006·Granted Feb 1, 2011·5 cites·21 claims
- 1045US5791968AGrinding method and grinding system for steelsKAWASAKI HEAVY IND LTD·Filed 1996·Granted Aug 11, 1998·13 cites·7 claims
- 1142US2016151929A1Method of and apparatus for dividing plate member made of brittle materialKAWASAKI HEAVY IND LTD·Filed 2014·Application pending·0 cites
- 1239US9101965B2High-pressure washing liquid ejecting washing apparatusAOKI YOSHIAKI·Filed 2009·Granted Aug 11, 2015·0 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →