Inventor · disambiguated record
Pi-Tsung Chen
Also filed as: CHEN PI-TSUNG
11 granted patents·4 pending applications·651 citations·filing 2004–2016
90Inventor score
Files withTAIWAN SEMICONDUCTOR MFG9WU ZHEN-CHENG2CHEN PI-TSUNG1LAI CHIH-MING1TAIWAN SEMICONDUCTOR MFG CO LTD1
Top patents by PatentIndex Score
15 records- 0196US9256709B2Method for integrated circuit mask patterningTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Feb 9, 2016·545 cites·20 claims
- 0295US8943445B2Method of merging color sets of layoutTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jan 27, 2015·29 cites·20 claims
- 0391US7312531B2Semiconductor device and fabrication method thereofTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Dec 25, 2007·22 cites·32 claims
- 0490US8631379B2Decomposing integrated circuit layoutCHEN PI-TSUNG·Filed 2010·Granted Jan 14, 2014·21 cites·14 claims
- 0582US9495507B2Method for integrated circuit mask patterningTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Nov 15, 2016·2 cites·20 claims
- 0680US7217648B2Post-ESL porogen burn-out for copper ELK integrationTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted May 15, 2007·23 cites·19 claims
- 0772US7247571B2Method for planarizing semiconductor structuresTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Jul 24, 2007·4 cites·21 claims
- 0866US10096544B2Semiconductor interconnect structureLAI CHIH MING·Filed 2012·Granted Oct 9, 2018·2 cites·20 claims
- 0949US7456093B2Method for improving a semiconductor device delamination resistanceTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Nov 25, 2008·3 cites·33 claims
- 1047US7834405B2Semiconductor device including I/O oxide and nitrided core oxide on substrateTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Nov 16, 2010·0 cites·7 claims
- 1143US8084328B2Semiconductor device including I/O oxide nitrided core oxide on substrateWU ZHEN-CHENG·Filed 2010·Granted Dec 27, 2011·0 cites·20 claims
- 1242US2007249164A1Method of fabricating an interconnect structureTAIWAN SEMICONDUCTOR MFG·Filed 2006·Application pending·0 cites
- 1340US2005140029A1Heterogeneous low k dielectricFiled 2004·Application pending·0 cites
- 1440US2006027924A1Metallization layers for crack prevention and reduced capacitanceTAIWAN SEMICONDUCTOR MFG·Filed 2004·Application pending·0 cites
- 1534US2006125102A1Back end of line integration schemeWU ZHEN-CHENG·Filed 2004·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Pi-Tsung Chen files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →