Inventor · disambiguated record
Mark Frederick Mccombs
Also filed as: MCCOMBS MARK F · MCCOMBS MARK FREDERICK
7 granted patents·7 pending applications·39 citations·filing 2005–2014
82Inventor score
Files withDU PONT6NAIR KUMARAN MANIKANTAN2NEEDES CHRISTOPHER R2E L DU PONT DE NEMOURS AND COM1HANG KENNETH WARREN1
Top patents by PatentIndex Score
14 records- 0186US7687417B2Lead free glass(es), thick film paste(s), tape composition(s) and low temperature cofired ceramic devices made therefromDU PONT·Filed 2006·Granted Mar 30, 2010·7 cites·24 claims
- 0285US8633858B2Method of manufacturing high frequency receiving and/or transmitting devices from low temperature co-fired ceramic materials and devices made therefromNAIR DEEPUKUMAR M·Filed 2011·Granted Jan 21, 2014·16 cites·18 claims
- 0374US7611645B2Thick film conductor compositions and the use thereof in LTCC circuits and devicesDU PONT·Filed 2006·Granted Nov 3, 2009·7 cites·7 claims
- 0472US8704105B2Mixed-metal system conductors for LTCC (low-temperature co-fired ceramic)NAIR KUMARAN MANIKANTAN·Filed 2010·Granted Apr 22, 2014·3 cites·6 claims
- 0568US7666328B2Thick film conductor composition(s) and processing technology thereof for use in multilayer electronic circuits and devicesDU PONT·Filed 2006·Granted Feb 23, 2010·4 cites·14 claims
- 0665US2012201009A1Lead free ltcc tape compositionHANG KENNETH WARREN·Filed 2011·Application pending·0 cites
- 0763US9307649B2Mixed-metal system conductors for use in low-temperature co-fired ceramic circuits and devicesDU PONT·Filed 2014·Granted Apr 5, 2016·0 cites·5 claims
- 0862US2009110939A1Lead free ltcc tape compositionDU PONT·Filed 2008·Application pending·0 cites
- 0958US7722732B2Thick film paste via fill composition for use in LTCC applicationsDU PONT·Filed 2006·Granted May 25, 2010·2 cites·1 claims
- 1055US2008023216A1Method of forming low temperature cofired composite ceramic devices for high frequency applications and compositions used thereinE L DU PONT DE NEMOURS AND COM·Filed 2007·Application pending·0 cites
- 1148US2006162844A1Multi-component LTCC substrate with a core of high dielectric constant ceramic material and processes for the development thereofNEEDES CHRISTOPHER R·Filed 2005·Application pending·0 cites
- 1242US2013052433A1Compositions for low k, low temperature co-fired composite (ltcc) tapes and low shrinkage, multi-layer ltcc structures formed therefromNAIR KUMARAN MANIKANTAN·Filed 2012·Application pending·0 cites
- 1340US2007023388A1Conductor composition for use in LTCC photosensitive tape on substrate applicationsNAIR KUMARAN M·Filed 2006·Application pending·0 cites
- 1439US2006163768A1Multi-component LTCC substrate with a core of high dielectric constant ceramic material and processes for the development thereofNEEDES CHRISTOPHER R·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →