Inventor · disambiguated record
Soon Hock Tong
Also filed as: TONG SOON HOCK
6 granted patents·31 citations·filing 2008–2015
78Inventor score
Top patents by PatentIndex Score
6 records- 0190US7969018B2Stacked semiconductor chips with separate encapsulationsINFINEON TECHNOLOGIES AG·Filed 2008·Granted Jun 28, 2011·22 cites·20 claims
- 0276US8334586B2Stacked semiconductor chips with separate encapsulationsOTREMBA RALF·Filed 2011·Granted Dec 18, 2012·4 cites·19 claims
- 0362US10096508B2Assembly for handling a semiconductor die and method of handling a semiconductor dieINFINEON TECHNOLOGIES AG·Filed 2015·Granted Oct 9, 2018·2 cites·18 claims
- 0459US7939381B2Method of semiconductor packaging and/or a semiconductor packageINFINEON TECHNOLOGIES AG·Filed 2009·Granted May 10, 2011·2 cites·18 claims
- 0554US7795712B2Lead frame with non-conductive connective barINFINEON TECHNOLOGIES AG·Filed 2008·Granted Sep 14, 2010·1 cites·18 claims
- 0648US7723165B2Method of forming component packageINFINEON TECHNOLOGIES AG·Filed 2008·Granted May 25, 2010·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →