Inventor · disambiguated record
Amit S. Kelkar
Also filed as: KELKAR AMIT · KELKAR AMIT S · KELKAR AMIT SUBHASH
21 granted patents·3 pending applications·167 citations·filing 2000–2016
94Inventor score
Files withMAXIM INTEGRATED PRODUCTS12ATMEL CORP6KELKAR AMIT SUBHASH2ABB LUMMUS GLOBAL INC1KELKAR AMIT S1
Top patents by PatentIndex Score
24 records- 0195US9324687B1Wafer-level passive device integrationMAXIM INTEGRATED PRODUCTS·Filed 2013·Granted Apr 26, 2016·26 cites·20 claims
- 0289US9000587B1Wafer-level thin chip integrationMAXIM INTEGRATED PRODUCTS·Filed 2013·Granted Apr 7, 2015·11 cites·20 claims
- 0389US6291367B1Method for depositing a selected thickness of an interlevel dielectric material to achieve optimum global planarity on a semiconductor waferATMEL CORP·Filed 2000·Granted Sep 18, 2001·51 cites·20 claims
- 0486US9190391B2Three-dimensional chip-to-wafer integrationKELKAR AMIT SUBHASH·Filed 2011·Granted Nov 17, 2015·13 cites·8 claims
- 0585US10134689B1Warpage compensation metal for wafer level packaging technologyMAXIM INTEGRATED PRODUCTS·Filed 2016·Granted Nov 20, 2018·5 cites·19 claims
- 0683US9704809B2Fan-out and heterogeneous packaging of electronic componentsMAXIM INTEGRATED PRODUCTS·Filed 2013·Granted Jul 11, 2017·7 cites·12 claims
- 0783US6489254B1Method of forming pre-metal dielectric film on a semiconductor substrate including first layer of undoped oxide of high ozone:TEOS volume ratio and second layer of low ozone doped BPSGATMEL CORP·Filed 2000·Granted Dec 3, 2002·28 cites·17 claims
- 0873US8878350B1Semiconductor device having a buffer material and stiffenerMAXIM INTEGRATED PRODUCTS·Filed 2013·Granted Nov 4, 2014·3 cites·20 claims
- 0972US9331048B2Bonded stacked wafers and methods of electroplating bonded stacked wafersMAXIM INTEGRATED PRODUCTS·Filed 2015·Granted May 3, 2016·1 cites·20 claims
- 1068US8860222B2Techniques for wafer-level processing of QFN packagesMAXIM INTEGRATED PRODUCTS·Filed 2012·Granted Oct 14, 2014·2 cites·11 claims
- 1167US6824687B2Extraction of phenol from wastewaterABB LUMMUS GLOBAL INC·Filed 2002·Granted Nov 30, 2004·5 cites·14 claims
- 1263US6828212B2Method of forming shallow trench isolation structure in a semiconductor deviceATMEL CORP·Filed 2002·Granted Dec 7, 2004·10 cites·17 claims
- 1358US8970043B2Bonded stacked wafers and methods of electroplating bonded stacked wafersZOU QUANBO·Filed 2011·Granted Mar 3, 2015·0 cites·16 claims
- 1454US9472451B2Technique for wafer-level processing of QFN packagesMAXIM INTEGRATED PRODUCTS·Filed 2014·Granted Oct 18, 2016·0 cites·7 claims
- 1549US8124916B2Thermal processing of silicon wafersKELKAR AMIT S·Filed 2007·Granted Feb 28, 2012·2 cites·14 claims
- 1648US6709990B2Method for fabrication of a high capacitance interpoly dielectricATMEL CORP·Filed 2002·Granted Mar 23, 2004·2 cites·5 claims
- 1746US10032749B2Three-dimensional chip-to-wafer integrationMAXIM INTEGRATED PRODUCTS·Filed 2015·Granted Jul 24, 2018·0 cites·11 claims
- 1846US9040386B2Method for varied topographic MEMS cap processMAXIM INTEGRATED PRODUCTS·Filed 2013·Granted May 26, 2015·0 cites·18 claims
- 1946US2008135988A1Method to reduce semiconductor device leakageMAXIM INTEGRATED PRODUCTS·Filed 2006·Application pending·0 cites
- 2045US9219043B2Wafer-level package device having high-standoff peripheral solder bumpsMAXIM INTEGRATED PRODUCTS·Filed 2013·Granted Dec 22, 2015·0 cites·20 claims
- 2145US6495475B2Method for fabrication of a high capacitance interpoly dielectricATMEL CORP·Filed 2001·Granted Dec 17, 2002·1 cites·16 claims
- 2245US2008150092A1Reduced Leakage within a Semiconductor DeviceKELKAR AMIT SUBHASH·Filed 2008·Application pending·0 cites
- 2342USRE40507EMethod of forming pre-metal dielectric film on a semiconductor substrate including first layer of undoped oxide of high ozone:TEOS volume ratio and second layer of low ozone doped BPSGATMEL CORP·Filed 2003·Granted Sep 16, 2008·0 cites·17 claims
- 2437US2012194306A1Preventing contact stiction in micro relaysSRIDHAR UPPILI·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →