Inventor · disambiguated record
Takafumi Tokunaga
Also filed as: TOKUNAGA TAKAFUMI
23 granted patents·1 pending application·552 citations·filing 1988–2008
96Inventor score
Top patents by PatentIndex Score
24 records- 0194US5972862ACleaning liquid for semiconductor devicesMITSUBISHI GAS CHEMICAL CO·Filed 1997·Granted Oct 26, 1999·234 cites·33 claims
- 0292US4931410AProcess for producing semiconductor integrated circuit device having copper interconnections and/or wirings, and device producedHITACHI LTD·Filed 1988·Granted Jun 5, 1990·137 cites·41 claims
- 0383US7419902B2Method of manufacture of semiconductor integrated circuitRENESAS TECH CORP·Filed 2005·Granted Sep 2, 2008·8 cites·44 claims
- 0480US6677244B2Specimen surface processing methodHITACHI LTD·Filed 2002·Granted Jan 13, 2004·18 cites·4 claims
- 0577US7737023B2Method of manufacture of semiconductor integrated circuit device and semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2008·Granted Jun 15, 2010·5 cites·27 claims
- 0671US6767838B1Method and apparatus for treating surface of semiconductorHITACHI LTD·Filed 2000·Granted Jul 27, 2004·11 cites·9 claims
- 0767US6660647B1Method for processing surface of sampleHITACHI LTD·Filed 1999·Granted Dec 9, 2003·28 cites·14 claims
- 0865US7427537B2Semiconductor integrated circuit device and method for manufacturing the sameRENESAS TECH CORP·Filed 2006·Granted Sep 23, 2008·2 cites·9 claims
- 0965US6849191B2Method and apparatus for treating surface of semiconductorHITACHI LTD·Filed 1999·Granted Feb 1, 2005·24 cites·6 claims
- 1063US6838320B2Method for manufacturing a semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2001·Granted Jan 4, 2005·8 cites·13 claims
- 1160US5874013ASemiconductor integrated circuit arrangement fabrication methodHITACHI LTD·Filed 1997·Granted Feb 23, 1999·18 cites·99 claims
- 1256US5933726AMethod of forming a semiconductor device have a screen stacked cell capacitorTEXAS INSTRUMENTS INC·Filed 1996·Granted Aug 3, 1999·17 cites·4 claims
- 1354US6309980B1Semiconductor integrated circuit arrangement fabrication methodHITACHI LTD·Filed 2000·Granted Oct 30, 2001·4 cites·61 claims
- 1450US7259104B2Sample surface processing methodHITACHI LTD·Filed 2003·Granted Aug 21, 2007·2 cites·7 claims
- 1546US6791137B2Semiconductor integrated circuit device and process for manufacturing the sameHITACHI LTD·Filed 2003·Granted Sep 14, 2004·2 cites·12 claims
- 1646US6555861B2Semiconductor integrated circuit device and process for manufacturing the sameHITACHI LTD·Filed 2001·Granted Apr 29, 2003·2 cites·25 claims
- 1746US6074958ASemiconductor integrated circuit arrangement fabrication methodHITACHI LTD·Filed 1999·Granted Jun 13, 2000·9 cites·9 claims
- 1845US5962347ASemiconductor integrated circuit arrangement fabrication methodHITACHI LTD·Filed 1998·Granted Oct 5, 1999·8 cites·33 claims
- 1944US7118949B2Semiconductor integrated circuit device and method for manufacturing the sameRENESAS TECH CORP·Filed 2004·Granted Oct 10, 2006·1 cites·13 claims
- 2044US7049243B2Surface processing method of a specimen and surface processing apparatus of the specimenHITACHI LTD·Filed 2004·Granted May 23, 2006·0 cites·4 claims
- 2142US6191045B1Method of treating surface of sampleHITACHI LTD·Filed 1999·Granted Feb 20, 2001·10 cites·18 claims
- 2240US2002125207A1Plasma processing methodFiled 2002·Application pending·0 cites
- 2337USRE39895ESemiconductor integrated circuit arrangement fabrication methodRENESAS TECH CORP·Filed 2002·Granted Oct 23, 2007·0 cites·35 claims
- 2437US6492277B1Specimen surface processing method and apparatusHITACHI LTD·Filed 1999·Granted Dec 10, 2002·4 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →