Inventor · disambiguated record
Lester T. Toy
Also filed as: TOY LESTER T
12 granted patents·2 pending applications·803 citations·filing 1979–2014
94Inventor score
Top patents by PatentIndex Score
14 records- 0197US4388607AConductive polymer compositions, and to devices comprising such compositionsRAYCHEM CORP·Filed 1979·Granted Jun 14, 1983·141 cites·49 claims
- 0296US4963698ACable sealingRAYCHEM CORP·Filed 1989·Granted Oct 16, 1990·131 cites·93 claims
- 0395US4721832AElectrical connection sealing deviceRAYCHEM CORP·Filed 1986·Granted Jan 26, 1988·118 cites·33 claims
- 0494US4589939AInsulating multiple-conductor cables using coated insert meansRAYCHEM CORP·Filed 1985·Granted May 20, 1986·108 cites·18 claims
- 0591US5177143AMethod of making heat stable polymeric gelloid compositionRAYCHEM CORP·Filed 1990·Granted Jan 5, 1993·84 cites·17 claims
- 0691US4497926AElastomer based adhesive compositionsRAYCHEM CORP·Filed 1984·Granted Feb 5, 1985·70 cites·17 claims
- 0785US4656070ACoextruded recoverable articlesRAYCHEM CORP·Filed 1985·Granted Apr 7, 1987·46 cites·55 claims
- 0882US4634615AHeat recoverable coextruded articlesVERSTEEGH WILLEM M·Filed 1985·Granted Jan 6, 1987·68 cites·11 claims
- 0953US2015147500A1Heat shrinkable tubeTYCO ELECTRONICS CORP·Filed 2013·Application pending·0 cites
- 1053US2015147499A1Heat shrinkable tube and system including heat-recovered heat shrinkable tubingTYCO ELECTRONICS CORP·Filed 2013·Application pending·0 cites
- 1150US4687280AHeat activatable sealing pistonRAYCHEM CORP·Filed 1985·Granted Aug 18, 1987·15 cites·13 claims
- 1248US10022934B2Heat recoverable tube assembly and adhesive composition for heat recoverable tube assemblyTYCO ELECTRONICS CORP·Filed 2014·Granted Jul 17, 2018·0 cites·20 claims
- 1348US4536445AElastomer based adhesive compositionsRAYCHEM CORP·Filed 1984·Granted Aug 20, 1985·13 cites·17 claims
- 1446US4523970AProcess for manufacturing sealant coated articlesRAYCHEM CORP·Filed 1983·Granted Jun 18, 1985·9 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →