Inventor · disambiguated record
Ming-Sung Kuo
Also filed as: KUO MING-SUNG
4 granted patents·1 pending application·4 citations·filing 2013–2025
63Inventor score
Technology areasH10P
Files withTAIWAN SEMICONDUCTOR MFG CO LTD5
Top patents by PatentIndex Score
5 records- 0189US12057353B2Measurement pattern and method for measuring overlay shift of bonded wafersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 6, 2024·2 cites·20 claims
- 0278US2025316539A1Method for measuring overlay shift of bonded wafersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0377US12406890B2Method for measuring overlay shift of bonded wafersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Sep 2, 2025·0 cites·20 claims
- 0468US11195737B2Apparatus for storing and transporting semiconductor elements, and method of making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 7, 2021·1 cites·20 claims
- 0553US9423359B2Wafer charging electromagnetic inspection tool and method of usingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Aug 23, 2016·1 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →