Inventor · disambiguated record
Ming-Shuoh Liang
Also filed as: LIANG MING-SHUOH
4 granted patents·3 pending applications·26 citations·filing 1999–2024
71Inventor score
Top patents by PatentIndex Score
7 records- 0181US10522396B1Methods of fabricating integrated circuit devices having reduced line end spacesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 31, 2019·4 cites·20 claims
- 0258US2025364412A1Structure for self-aligned via and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0355US7777338B2Seal ring structure for integrated circuit chipsTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Aug 17, 2010·6 cites·50 claims
- 0450US6234029B1Testing module for testing the strength of the welding area on a PCBADVANCED SEMICONDUCTOR ENG·Filed 1999·Granted May 22, 2001·16 cites·10 claims
- 0541US11348828B2Interconnect structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted May 31, 2022·0 cites·20 claims
- 0639US2005230005A1Test pad for reducing die sawing damageTAIWAN SEMICONDUCTOR MFG·Filed 2005·Application pending·0 cites
- 0735US2004262762A1Method of providing via in a multilayer semiconductor deviceFiled 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →