Inventor · disambiguated record
Hiroaki Kishi
Also filed as: KISHI HIROAKI
16 granted patents·2 pending applications·92 citations·filing 1990–2019
90Inventor score
Top patents by PatentIndex Score
18 records- 0193US9776280B2Laser welding methodTOYOTA MOTOR CO LTD·Filed 2015·Granted Oct 3, 2017·12 cites·3 claims
- 0293US9517533B2Welded portion inspection apparatus and inspection method thereof, with inspection in different zones of the molten poolTOYOTA MOTOR CO LTD·Filed 2014·Granted Dec 13, 2016·16 cites·12 claims
- 0380US9506862B2Welded portion inspection apparatus and inspection method thereofTOYOTA MOTOR CO LTD·Filed 2014·Granted Nov 29, 2016·4 cites·6 claims
- 0470US9633984B2Semiconductor moduleTOSHIBA KK·Filed 2016·Granted Apr 25, 2017·2 cites·7 claims
- 0567US10347551B2Semiconductor packageTOSHIBA KK·Filed 2017·Granted Jul 9, 2019·1 cites·20 claims
- 0665US5975178AManufacturing method of film carrier tape, manufacturing apparatus of film carrier tape, and film carrier tapeTOSHIBA KK·Filed 1997·Granted Nov 2, 1999·33 cites·11 claims
- 0763US10204891B2Semiconductor moduleTOSHIBA KK·Filed 2017·Granted Feb 12, 2019·1 cites·7 claims
- 0853US10490485B2Semiconductor deviceTOSHIBA KK·Filed 2018·Granted Nov 26, 2019·0 cites·16 claims
- 0952US6729759B2Track rail mounting structure of rectilinear guide apparatusTHK CO LTD·Filed 2002·Granted May 4, 2004·5 cites·6 claims
- 1050US10026677B2Semiconductor deviceTOSHIBA KK·Filed 2016·Granted Jul 17, 2018·0 cites·17 claims
- 1149US5162894ASemiconductor integrated circuit having a dummy lead and shaped inner leadsTOSHIBA KK·Filed 1990·Granted Nov 10, 1992·18 cites·8 claims
- 1244US9623513B2Laser welding inspection apparatus and laser welding inspection methodTOYOTA MOTOR CO LTD·Filed 2015·Granted Apr 18, 2017·0 cites·7 claims
- 1342US2020303249A1Semiconductor package, die attach film, and method for manufacturing die attach filmTOSHIBA KK·Filed 2019·Application pending·0 cites
- 1440US10840166B2Semiconductor deviceTOSHIBA KK·Filed 2018·Granted Nov 17, 2020·0 cites·8 claims
- 1539US11264313B2Semiconductor device and method for manufacturing sameTOSHIBA KK·Filed 2019·Granted Mar 1, 2022·0 cites·12 claims
- 1639US9969028B2Welded portion inspection methodTOYOTA MOTOR CO LTD·Filed 2015·Granted May 15, 2018·0 cites·2 claims
- 1738US10005153B2Laser beam welding apparatus and laser beam welding methodTOYOTA MOTOR CO LTD·Filed 2015·Granted Jun 26, 2018·0 cites·2 claims
- 1835US2016351464A1Semiconductor device packageTOSHIBA KK·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →