Inventor · disambiguated record
Kazuhiro Mitamura
Also filed as: MITAMURA KAZUHIRO
19 granted patents·6 pending applications·111 citations·filing 1989–2022
92Inventor score
Files withRENESAS ELECTRONICS CORP8NISSAN MOTOR7NEC ELECTRONICS CORP4MITAMURA KAZUHIRO2ASAHI GLASS CO LTD1
Top patents by PatentIndex Score
25 records- 0193US7406849B2Preform, hydroforming method, and hydroformed productNISSAN MOTOR·Filed 2005·Granted Aug 5, 2008·26 cites·6 claims
- 0284US9641102B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2015·Granted May 2, 2017·5 cites·18 claims
- 0381US9530723B2Semiconductor device and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2015·Granted Dec 27, 2016·3 cites·15 claims
- 0481US7260285B2Optical module with flexible substrateNEC ELECTRONICS CORP·Filed 2006·Granted Aug 21, 2007·12 cites·5 claims
- 0576US7861489B2Preform, hydroforming method, and hydroformed productNISSAN MOTOR·Filed 2009·Granted Jan 4, 2011·5 cites·14 claims
- 0674US9236954B2Photocoupler with protrusionRENESAS ELECTRONICS CORP·Filed 2013·Granted Jan 12, 2016·4 cites·11 claims
- 0758US7614271B2Preform, hydroforming method, and hydroformed productNISSAN MOTOR·Filed 2008·Granted Nov 10, 2009·1 cites·4 claims
- 0856US4945498ACAD/CAM plotting system by one-stroke sketchingNISSAN MOTOR·Filed 1989·Granted Jul 31, 1990·24 cites·9 claims
- 0954US5460737AGraphite-free lubricating oilKYODO YUSHI·Filed 1994·Granted Oct 24, 1995·14 cites·8 claims
- 1053US12237254B2Semiconductor device including wiring substrate having multiple signal wirings and multiple insulating layersRENESAS ELECTRONICS CORP·Filed 2022·Granted Feb 25, 2025·0 cites·10 claims
- 1151US10259032B2Cutting device for metal foilNISSAN MOTOR·Filed 2014·Granted Apr 16, 2019·0 cites·8 claims
- 1251US5406825AForging dieASAHI GLASS CO LTD·Filed 1994·Granted Apr 18, 1995·16 cites·7 claims
- 1349US10141248B2Semiconductor device and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2016·Granted Nov 27, 2018·0 cites·11 claims
- 1449US8328436B2Optical moduleMITAMURA KAZUHIRO·Filed 2010·Granted Dec 11, 2012·1 cites·7 claims
- 1549US2024203812A1Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2022·Application pending·0 cites
- 1646US2007089900A1Flexible boardNEC ELECTRONICS CORP·Filed 2006·Application pending·0 cites
- 1745US11462449B2Semiconductor deviceNISSAN MOTOR·Filed 2018·Granted Oct 4, 2022·0 cites·7 claims
- 1844US7213977B2Optical module with can packageNEC CORP·Filed 2006·Granted May 8, 2007·0 cites·10 claims
- 1944US2009129727A1Method of manufacturing optical module and method of manufacturing optical transceiverNEC ELECTRONICS CORP·Filed 2008·Application pending·0 cites
- 2044US2008251698A1Semiconductor optical receiver moduleNEC ELECTRONICS CORP·Filed 2007·Application pending·0 cites
- 2143US7788856B2Preform, hydroforming method, and hydroformed productNISSAN MOTOR·Filed 2005·Granted Sep 7, 2010·0 cites·33 claims
- 2242US7874741B2Optical module and process for manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2010·Granted Jan 25, 2011·0 cites·8 claims
- 2342US2016087729A1Photocoupler with protrusionRENESAS ELECTRONICS CORP·Filed 2015·Application pending·0 cites
- 2435US2012057828A1Optical transmission module and method for manufacturing optical transmission moduleMITAMURA KAZUHIRO·Filed 2011·Application pending·0 cites
- 2531US10259058B2Workpiece cutting methodSHIJO AKIHIRO·Filed 2011·Granted Apr 16, 2019·0 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →