Inventor · disambiguated record
Daichi Takemori
Also filed as: TAKEMORI DAICHI
3 granted patents·0 citations·filing 2008–2020
44Inventor score
Technology areasH10W
Top patents by PatentIndex Score
3 records- 0150US12319814B2Polyamideimide resin, resin composition, and semiconductor deviceSHOWA DENKO MATERIALS CO LTD·Filed 2020·Granted Jun 3, 2025·0 cites·8 claims
- 0244US8771828B2Sealing film and a semiconductor device using the sameKAWAKAMI HIROYUKI·Filed 2008·Granted Jul 8, 2014·0 cites·16 claims
- 0343US8715454B2Sealing film and a semiconductor device using the sameKAWAKAMI HIROYUKI·Filed 2012·Granted May 6, 2014·0 cites·22 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →