Inventor · disambiguated record
Henning M. Hauenstein
Also filed as: HAUENSTEIN HENNING · HAUENSTEIN HENNING M
32 granted patents·3 pending applications·327 citations·filing 2001–2014
97Inventor score
Files withINT RECTIFIER CORP16BOSCH GMBH ROBERT8HAUENSTEIN HENNING M8HAUENSTEIN HENNING1INFINEON TECHNOLOGIES AMERICAS CORP1
Top patents by PatentIndex Score
35 records- 0198US8604611B2Semiconductor device assembly utilizing a DBC substrateINT RECTIFIER CORP·Filed 2013·Granted Dec 10, 2013·32 cites·20 claims
- 0298US8018056B2Package for high power density devicesINT RECTIFIER CORP·Filed 2006·Granted Sep 13, 2011·49 cites·40 claims
- 0396US8368210B2Wafer scale package for high power devicesINT RECTIFIER CORP·Filed 2011·Granted Feb 5, 2013·16 cites·11 claims
- 0492US7619302B2Highly efficient both-side-cooled discrete power package, especially basic element for innovative power modulesINT RECTIFIER CORP·Filed 2007·Granted Nov 17, 2009·24 cites·18 claims
- 0589US8928115B2Semiconductor package having internal shunt and solder stop dimplesINT RECTIFIER CORP·Filed 2013·Granted Jan 6, 2015·6 cites·20 claims
- 0688US8736040B2Power module with current routingINT RECTIFIER CORP·Filed 2013·Granted May 27, 2014·11 cites·20 claims
- 0788US7834575B2Gate-driver IC with HV-isolation, especially hybrid electric vehicle motor drive conceptINT RECTIFIER CORP·Filed 2008·Granted Nov 16, 2010·16 cites·20 claims
- 0888US7554188B2Low inductance bond-wireless co-package for high power density devices, especially for IGBTs and diodesINT RECTIFIER CORP·Filed 2007·Granted Jun 30, 2009·16 cites·14 claims
- 0987US8987777B2Stacked half-bridge power moduleHAUENSTEIN HENNING M·Filed 2011·Granted Mar 24, 2015·9 cites·20 claims
- 1085US7567053B2Mechatronic integration of motor drive and E-machine, especially smart-E-motorINT RECTIFIER CORP·Filed 2007·Granted Jul 28, 2009·13 cites·13 claims
- 1184US8569883B2Package for high power devicesHAUENSTEIN HENNING M·Filed 2011·Granted Oct 29, 2013·4 cites·18 claims
- 1283US7956566B2Driver IC with HV-isolation, especially hybrid electric vehicle motor drive conceptINT RECTIFIER CORP·Filed 2008·Granted Jun 7, 2011·11 cites·20 claims
- 1383US6744250B2Device for measuring the strength of a vector component of a magnetic field, current-measuring device and use of a field-effect transistorBOSCH GMBH ROBERT·Filed 2002·Granted Jun 1, 2004·33 cites·4 claims
- 1482US9054119B2Dual compartment semiconductor packageINT RECTIFIER CORP·Filed 2014·Granted Jun 9, 2015·4 cites·14 claims
- 1581US8680666B2Bond wireless power module with double-sided single device cooling and immersion bath coolingHAUENSTEIN HENNING M·Filed 2007·Granted Mar 25, 2014·10 cites·20 claims
- 1678US9559068B2Wafer scale package for high power devicesINFINEON TECHNOLOGIES AMERICAS CORP·Filed 2014·Granted Jan 31, 2017·2 cites·14 claims
- 1776US8350376B2Bondwireless power module with three-dimensional current routingINT RECTIFIER CORP·Filed 2011·Granted Jan 8, 2013·4 cites·24 claims
- 1874US8102668B2Semiconductor device package with internal device protectionHAUENSTEIN HENNING M·Filed 2008·Granted Jan 24, 2012·6 cites·17 claims
- 1971US8836112B2Semiconductor package for high power devicesINT RECTIFIER CORP·Filed 2013·Granted Sep 16, 2014·1 cites·16 claims
- 2071US8637981B2Dual compartment semiconductor package with temperature sensorHAUENSTEIN HENNING M·Filed 2011·Granted Jan 28, 2014·2 cites·10 claims
- 2167US9001518B2Power module with press-fit clampsHAUENSTEIN HENNING M·Filed 2011·Granted Apr 7, 2015·2 cites·20 claims
- 2267US8804340B2Power semiconductor package with double-sided coolingHAUENSTEIN HENNING M·Filed 2011·Granted Aug 12, 2014·2 cites·20 claims
- 2367US7723830B2Substrate and method for mounting silicon deviceINT RECTIFIER CORP·Filed 2007·Granted May 25, 2010·3 cites·20 claims
- 2467US7208829B2Semiconductor componentBOSCH GMBH ROBERT·Filed 2003·Granted Apr 24, 2007·17 cites·7 claims
- 2567US6953281B2Method for determining temperatures on semiconductor componentsBOSCH GMBH ROBERT·Filed 2002·Granted Oct 11, 2005·14 cites·17 claims
- 2666US8860198B2Semiconductor package with temperature sensorINT RECTIFIER CORP·Filed 2014·Granted Oct 14, 2014·1 cites·20 claims
- 2763US7573727B2Connecting device for contacting a semiconductor componentBOSCH GMBH ROBERT·Filed 2003·Granted Aug 11, 2009·12 cites·19 claims
- 2851US9102242B2Mechatronic integration of motor drive and E-machine, especially smart-E-motorHAUENSTEIN HENNING·Filed 2007·Granted Aug 11, 2015·3 cites·23 claims
- 2946US7259537B2Polarity-reversal protection circuit for energy sourcesBOSCH GMBH ROBERT·Filed 2002·Granted Aug 21, 2007·3 cites·21 claims
- 3044US2014224409A1Sintering Utilizing Non-Mechanical PressureINT RECTIFIER CORP·Filed 2014·Application pending·0 cites
- 3141US7121721B2Apparatus and method for measuring operating temperatures of an electrical componentBOSCH GMBH ROBERT·Filed 2002·Granted Oct 17, 2006·1 cites·7 claims
- 3241US2007257343A1Die-on-leadframe (dol) with high voltage isolationHAUENSTEIN HENNING M·Filed 2007·Application pending·0 cites
- 3337US6777766B2Device for sensing a magnetic field, magnetic field meter and an ammeterBOSCH GMBH ROBERT·Filed 2001·Granted Aug 17, 2004·0 cites·9 claims
- 3436US7190156B2Device for measuring a B-component of a magnetic field, a magnetic field sensor and an ammeterBOSCH GMBH ROBERT·Filed 2002·Granted Mar 13, 2007·0 cites·12 claims
- 3535US2003155905A1Device, amperemeter and motor vehicleFiled 2002·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Henning M. Hauenstein files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →