Inventor · disambiguated record
Sung Min Song
Also filed as: SONG SUNG MIN
16 granted patents·4 pending applications·12 citations·filing 1996–2022
86Inventor score
Top patents by PatentIndex Score
20 records- 0179US12406786B2Coil componentSAMSUNG ELECTRO MECH·Filed 2022·Granted Sep 2, 2025·0 cites·17 claims
- 0277US11056272B2InductorSAMSUNG ELECTRO MECH·Filed 2018·Granted Jul 6, 2021·1 cites·17 claims
- 0375US11282637B2InductorSAMSUNG ELECTRO MECH·Filed 2019·Granted Mar 22, 2022·1 cites·18 claims
- 0471US10636823B2Image sensor assembly, method of manufacturing the same, and camera moduleSAMSUNG ELECTRO MECH·Filed 2018·Granted Apr 28, 2020·1 cites·15 claims
- 0566US11424058B2Coil componentSAMSUNG ELECTRO MECH·Filed 2018·Granted Aug 23, 2022·0 cites·18 claims
- 0661US11017926B2Coil componentSAMSUNG ELECTRO MECH·Filed 2018·Granted May 25, 2021·0 cites·20 claims
- 0761US9257376B2Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2014·Granted Feb 9, 2016·1 cites·20 claims
- 0860US10600550B2Coil componentSAMSUNG ELECTRO MECH·Filed 2018·Granted Mar 24, 2020·0 cites·14 claims
- 0959US10741320B2Coil componentSAMSUNG ELECTRO MECH·Filed 2017·Granted Aug 11, 2020·0 cites·20 claims
- 1056US11881345B2Coil componentSAMSUNG ELECTRO MECH·Filed 2019·Granted Jan 23, 2024·0 cites·21 claims
- 1151US11495395B2InductorSAMSUNG ELECTRO MECH·Filed 2018·Granted Nov 8, 2022·0 cites·20 claims
- 1250US9929195B2Image sensor assembly, method of manufacturing the same, and camera moduleSAMSUNG ELECTRO MECH·Filed 2016·Granted Mar 27, 2018·0 cites·13 claims
- 1350US9281257B2Semiconductor package including a connecting memberSAMSUNG ELECTRO MECH·Filed 2014·Granted Mar 8, 2016·0 cites·12 claims
- 1448US9305829B2Semiconductor package with an indented portion and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2014·Granted Apr 5, 2016·0 cites·14 claims
- 1547US9161479B2Power module package and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2014·Granted Oct 13, 2015·0 cites·19 claims
- 1645US2023002349A1Tricyclic compound and pharmaceutical use thereofJD BIOSCIENCE INC·Filed 2020·Application pending·0 cites
- 1744US2015187726A1Semiconductor package and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 1843US2015181754A1Power module packageSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 1942US2015146382A1Package substrate, method of manufacturing the same, and power module package using package substrateSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 2030US5903543AApparatus and method of preventing cell data loss during clock switchingSAMSUNG ELECTRONICS CO LTD·Filed 1996·Granted May 11, 1999·8 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →