Inventor · disambiguated record
George H. Thiel
Also filed as: THIEL GEORGE H · THIEL GEORGE HENRY
16 granted patents·1 pending application·360 citations·filing 1995–2008
95Inventor score
Top patents by PatentIndex Score
17 records- 0194US6552266B2High performance chip packaging and methodIBM·Filed 2001·Granted Apr 22, 2003·96 cites·12 claims
- 0291US7086147B2Method of accommodating in volume expansion during solder reflowIBM·Filed 2004·Granted Aug 8, 2006·40 cites·1 claims
- 0386US6235994B1Thermal/electrical break for printed circuit boardsIBM·Filed 1998·Granted May 22, 2001·67 cites·24 claims
- 0480US6759270B2Semiconductor chip module and method of manufacture of sameIBM·Filed 2003·Granted Jul 6, 2004·23 cites·8 claims
- 0578US7045562B2Method and structure for self healing cracks in underfill material between an I/C chip and a substrate bonded together with solder ballsIBM·Filed 2003·Granted May 16, 2006·26 cites·14 claims
- 0677US6756662B2Semiconductor chip module and method of manufacture of sameIBM·Filed 2002·Granted Jun 29, 2004·19 cites·10 claims
- 0775US6686664B2Structure to accommodate increase in volume expansion during solder reflowIBM·Filed 2001·Granted Feb 3, 2004·15 cites·19 claims
- 0868US6649833B1Negative volume expansion lead-free electrical connectionIBM·Filed 2002·Granted Nov 18, 2003·12 cites·20 claims
- 0959US6226187B1Integrated circuit packageIBM·Filed 1999·Granted May 1, 2001·21 cites·16 claims
- 1058US7703199B2Method to accommodate increase in volume expansion during solder reflowIBM·Filed 2006·Granted Apr 27, 2010·1 cites·5 claims
- 1154US6967389B2Wafer with semiconductor chips mounted thereonIBM·Filed 2003·Granted Nov 22, 2005·4 cites·5 claims
- 1254US6731012B1Non-planar surface for semiconductor chipsIBM·Filed 1999·Granted May 4, 2004·15 cites·17 claims
- 1348US7037753B2Non-planar surface for semiconductor chipsIBM·Filed 2004·Granted May 2, 2006·2 cites·18 claims
- 1445US2009200007A1Heat exchanger having temperature-actuated valvesLOCKHEED CORP·Filed 2008·Application pending·0 cites
- 1544US6552264B2High performance chip packaging and methodIBM·Filed 1998·Granted Apr 22, 2003·9 cites·8 claims
- 1643US6084299AIntegrated circuit package including a heat sink and an adhesiveIBM·Filed 1995·Granted Jul 4, 2000·10 cites·13 claims
- 1738US6655020B2Method of packaging a high performance chipIBM·Filed 2001·Granted Dec 2, 2003·0 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →