Inventor · disambiguated record
Donald W. Henderson
Also filed as: HENDERSON DONALD W · HENDERSON DONALD WESLEY
26 granted patents·6 pending applications·414 citations·filing 1983–2013
96Inventor score
Top patents by PatentIndex Score
32 records- 0193US6805974B2Lead-free tin-silver-copper alloy solder compositionIBM·Filed 2002·Granted Oct 19, 2004·59 cites·73 claims
- 0291US7086147B2Method of accommodating in volume expansion during solder reflowIBM·Filed 2004·Granted Aug 8, 2006·40 cites·1 claims
- 0387US7079393B2Fluidic cooling systems and methods for electronic componentsIBM·Filed 2004·Granted Jul 18, 2006·44 cites·21 claims
- 0482US6217671B1Composition for increasing activity of a no-clean fluxIBM·Filed 1999·Granted Apr 17, 2001·35 cites·15 claims
- 0579US6550667B2Flux composition and soldering method for high density arraysIBM·Filed 2000·Granted Apr 22, 2003·17 cites·32 claims
- 0677US8157158B2Modification of solder alloy compositions to suppress interfacial void formation in solder jointsGRUBER PETER A·Filed 2007·Granted Apr 17, 2012·5 cites·12 claims
- 0777US7273803B2Ball limiting metallurgy, interconnection structure including the same, and method of forming an interconnection structureIBM·Filed 2003·Granted Sep 25, 2007·16 cites·14 claims
- 0875US6686664B2Structure to accommodate increase in volume expansion during solder reflowIBM·Filed 2001·Granted Feb 3, 2004·15 cites·19 claims
- 0975US4534827ACutting implement and method of making sameHENDERSON DONALD W·Filed 1983·Granted Aug 13, 1985·87 cites·8 claims
- 1073US6598505B2Punch actuator monitoring system and methodIBM·Filed 2001·Granted Jul 29, 2003·7 cites·12 claims
- 1172US6024266ASystem and method for transporting and clamping flexible film structuresIBM·Filed 1998·Granted Feb 15, 2000·17 cites·20 claims
- 1269US8493746B2Additives for grain fragmentation in Pb-free Sn-based solderARVIN CHARLES L·Filed 2010·Granted Jul 23, 2013·2 cites·14 claims
- 1369US6468363B2Composition for increasing activity of a no-clean fluxIBM·Filed 2001·Granted Oct 22, 2002·10 cites·5 claims
- 1468US6649833B1Negative volume expansion lead-free electrical connectionIBM·Filed 2002·Granted Nov 18, 2003·12 cites·20 claims
- 1565US8314500B2Interconnections for flip-chip using lead-free solders and having improved reaction barrier layersBELANGER LUC·Filed 2006·Granted Nov 20, 2012·4 cites·1 claims
- 1660US7784669B2Method and process for reducing undercooling in a lead-free tin-rich solder alloyIBM·Filed 2009·Granted Aug 31, 2010·1 cites·11 claims
- 1760US6190530B1Anode container, electroplating system, method and plated objectIBM·Filed 1999·Granted Feb 20, 2001·13 cites·31 claims
- 1859US7932169B2Interconnection for flip-chip using lead-free solders and having improved reaction barrier layersIBM·Filed 2009·Granted Apr 26, 2011·1 cites·3 claims
- 1959US7703661B2Method and process for reducing undercooling in a lead-free tin-rich solder alloyIBM·Filed 2007·Granted Apr 27, 2010·1 cites·22 claims
- 2058US7703199B2Method to accommodate increase in volume expansion during solder reflowIBM·Filed 2006·Granted Apr 27, 2010·1 cites·5 claims
- 2158US5957360ASystem and method for transporting and clamping flexible film structuresIBM·Filed 1998·Granted Sep 28, 1999·11 cites·12 claims
- 2256US2012205425A1Modification of solder alloy compositions to suppress interfacial void formation in solder jointsGRUBER PETER A·Filed 2012·Application pending·0 cites
- 2356US2012201596A1Modification of solder alloy compositions to suppress interfacial void formation in solder jointsGRUBER PETER A·Filed 2012·Application pending·0 cites
- 2453US8910853B2Additives for grain fragmentation in Pb-free Sn-based solderIBM·Filed 2013·Granted Dec 16, 2014·0 cites·17 claims
- 2553US6305258B1Punch actuator monitoring system and methodIBM·Filed 1998·Granted Oct 23, 2001·13 cites·15 claims
- 2647US2009197114A1Modification of pb-free solder alloy compositions to improve interlayer dielectric delamination in silicon devices and electromigration resistance in solder jointsSHIH DA-YUAN·Filed 2008·Application pending·0 cites
- 2747US2009197103A1Modification of pb-free solder alloy compositions to improve interlayer dielectric delamination in silicon devices and electromigration resistance in solder jointsSHIH DA-YUAN·Filed 2008·Application pending·0 cites
- 2844US6921015B2Solder protective coating and fluxless joining of flip chip devices on laminates with plated solderIBM·Filed 2003·Granted Jul 26, 2005·1 cites·10 claims
- 2941US2008008900A1Ball Limiting Metallurgy, Interconnection Structure Including the Same, and Method of Forming an Interconnection StructureCHENG YU-TING·Filed 2007·Application pending·0 cites
- 3037US6585150B1Solder protective coating and fluxless joining of flip chip devices on laminates with plated solderIBM·Filed 2000·Granted Jul 1, 2003·0 cites·15 claims
- 3137US2005104208A1Stabilizing copper overlayer for enhanced c4 interconnect reliabilityIBM·Filed 2003·Application pending·0 cites
- 3229US5902495AMethod and apparatus for establishing a solder bond to a solder ball grid arrayIBM·Filed 1996·Granted May 11, 1999·2 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →