Inventor · disambiguated record
David V. Caletka
Also filed as: CALETKA DAVID V · CALETKA DAVID VINCENT
30 granted patents·1 pending application·1,150 citations·filing 1996–2008
98Inventor score
Top patents by PatentIndex Score
31 records- 0196US6913948B2Partially captured oriented interconnections for BGA packages and a method of forming the interconnectionsIBM·Filed 2003·Granted Jul 5, 2005·126 cites·20 claims
- 0295US6528892B2Land grid array stiffener use with flexible chip carriersIBM·Filed 2001·Granted Mar 4, 2003·108 cites·18 claims
- 0392US6627998B1Wafer scale thin film packageIBM·Filed 2000·Granted Sep 30, 2003·58 cites·18 claims
- 0491US7086147B2Method of accommodating in volume expansion during solder reflowIBM·Filed 2004·Granted Aug 8, 2006·40 cites·1 claims
- 0591US6695623B2Enhanced electrical/mechanical connection for electronic devicesIBM·Filed 2001·Granted Feb 24, 2004·54 cites·10 claims
- 0690US6507116B1Electronic package and method of formingIBM·Filed 1999·Granted Jan 14, 2003·107 cites·8 claims
- 0789US6104093AThermally enhanced and mechanically balanced flip chip package and method of formingIBM·Filed 1998·Granted Aug 15, 2000·92 cites·15 claims
- 0888US6410988B1Thermally enhanced and mechanically balanced flip chip package and method of formingIBM·Filed 2000·Granted Jun 25, 2002·45 cites·18 claims
- 0988US6274474B1Method of forming BGA interconnections having mixed solder profilesIBM·Filed 1999·Granted Aug 14, 2001·88 cites·18 claims
- 1084US6933619B2Electronic package and method of formingIBM·Filed 2002·Granted Aug 23, 2005·34 cites·7 claims
- 1184US6774474B1Partially captured oriented interconnections for BGA packages and a method of forming the interconnectionsIBM·Filed 1999·Granted Aug 10, 2004·66 cites·12 claims
- 1284US6541857B2Method of forming BGA interconnections having mixed solder profilesIBM·Filed 2001·Granted Apr 1, 2003·35 cites·12 claims
- 1382US6051982AElectronic component test apparatus with rotational probe and conductive spaced apart meansIBM·Filed 1997·Granted Apr 18, 2000·52 cites·36 claims
- 1481US5947750AElastomeric structure with multi-layered elastomer and constraining baseIBM·Filed 1997·Granted Sep 7, 1999·50 cites·35 claims
- 1577US6333551B1Surface profiling in electronic packages for reducing thermally induced interfacial stressesIBM·Filed 2000·Granted Dec 25, 2001·26 cites·32 claims
- 1675US6686664B2Structure to accommodate increase in volume expansion during solder reflowIBM·Filed 2001·Granted Feb 3, 2004·15 cites·19 claims
- 1771US5873740AElectrical connector system with member having layers of different durometer elastomeric materialsIBM·Filed 1998·Granted Feb 23, 1999·29 cites·30 claims
- 1870US6268567B1Dual purpose ribbon cableIBM·Filed 2000·Granted Jul 31, 2001·9 cites·11 claims
- 1968US6649833B1Negative volume expansion lead-free electrical connectionIBM·Filed 2002·Granted Nov 18, 2003·12 cites·20 claims
- 2068US6138893AMethod for producing a reliable BGA solder joint interconnectionIBM·Filed 1998·Granted Oct 31, 2000·26 cites·18 claims
- 2168US5804984AElectronic component test apparatus with rotational probeIBM·Filed 1996·Granted Sep 8, 1998·30 cites·32 claims
- 2267US6433283B2Dual purpose ribbon cableIBM·Filed 2001·Granted Aug 13, 2002·7 cites·15 claims
- 2364US6672500B2Method for producing a reliable solder joint interconnectionIBM·Filed 2001·Granted Jan 6, 2004·10 cites·20 claims
- 2464US6603195B1Planarized plastic package modules for integrated circuitsIBM·Filed 2000·Granted Aug 5, 2003·15 cites·16 claims
- 2558US7703199B2Method to accommodate increase in volume expansion during solder reflowIBM·Filed 2006·Granted Apr 27, 2010·1 cites·5 claims
- 2655US6595784B2Interposer member having apertures for relieving stress and increasing contact compliancyIBM·Filed 2001·Granted Jul 22, 2003·6 cites·36 claims
- 2753US6293455B1Method for producing a reliable BGA solder joint interconnectionIBM·Filed 2000·Granted Sep 25, 2001·4 cites·17 claims
- 2851US2008119029A1Wafer scale thin film packageCALETKA DAVID VINCENT·Filed 2008·Application pending·0 cites
- 2950US7348261B2Wafer scale thin film packageIBM·Filed 2003·Granted Mar 25, 2008·3 cites·6 claims
- 3047US6905961B2Land grid array stiffener for use with flexible chip carriersIBM·Filed 2003·Granted Jun 14, 2005·2 cites·16 claims
- 3137US7499614B2Passive alignment of VCSELs to waveguides in opto-electronic cards and printed circuit boardsIBM·Filed 2003·Granted Mar 3, 2009·0 cites·14 claims
Join the waitlist — get patent alerts
Get an alert when David V. Caletka files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →