Inventor · disambiguated record
Masato Nomiya
Also filed as: NOMIYA MASATO
16 granted patents·1 pending application·36 citations·filing 2004–2021
89Inventor score
Top patents by PatentIndex Score
17 records- 0180US7595997B2Multilayer ceramic electronic component, multilayer ceramic substrate, and method for manufacturing multilayer ceramic electronic componentMURATA MANUFACTURING CO·Filed 2008·Granted Sep 29, 2009·8 cites·11 claims
- 0277US8371026B2Method for manufacturing multilayer ceramic electronic deviceMURATA MANUFACTURING CO·Filed 2008·Granted Feb 12, 2013·6 cites·13 claims
- 0377US7691469B2Ceramic multilayer substrate and method for manufacturing the sameMURATA MANUFACTURING CO·Filed 2008·Granted Apr 6, 2010·9 cites·9 claims
- 0470US8304661B2Ceramic composite multilayer substrate, method for manufacturing ceramic composite multilayer substrate and electronic componentNOMIYA MASATO·Filed 2010·Granted Nov 6, 2012·2 cites·20 claims
- 0570US8168288B2Multilayer ceramic substrate and method for manufacturing the sameNOMIYA MASATO·Filed 2009·Granted May 1, 2012·5 cites·13 claims
- 0668US11239821B2Electronic component deviceMURATA MANUFACTURING CO·Filed 2019·Granted Feb 1, 2022·1 cites·19 claims
- 0765US11695388B2Elastic wave deviceMURATA MANUFACTURING CO·Filed 2018·Granted Jul 4, 2023·1 cites·20 claims
- 0862US11963302B2Electronic componentMURATA MANUFACTURING CO·Filed 2021·Granted Apr 16, 2024·0 cites·20 claims
- 0958US8541694B2Multilayer wiring boardNOMIYA MASATO·Filed 2009·Granted Sep 24, 2013·1 cites·7 claims
- 1052US11929738B2Electronic deviceMURATA MANUFACTURING CO·Filed 2021·Granted Mar 12, 2024·0 cites·20 claims
- 1152US2009272566A1Electrically conductive paste and multilayer ceramic substrateMURATA MANUFACTURING CO·Filed 2009·Application pending·0 cites
- 1250US9226400B2Multilayer ceramic electronic device and method for manufacturing the sameMURATA MANUFACTURING CO·Filed 2013·Granted Dec 29, 2015·0 cites·4 claims
- 1349US11948854B2Electronic component and electronic component module including the sameMURATA MANUFACTURING CO·Filed 2021·Granted Apr 2, 2024·0 cites·9 claims
- 1449US7569162B2Electrically conductive paste and multilayer ceramic substrateMURATA MANUFACTURING CO·Filed 2004·Granted Aug 4, 2009·3 cites·18 claims
- 1547US10607775B2Electronic component device, high-frequency front end circuit, and communication deviceMURATA MANUFACTURING CO·Filed 2019·Granted Mar 31, 2020·0 cites·20 claims
- 1646US9565757B2Electronic component and manufacturing method thereforMURATA MANUFACTURING CO·Filed 2015·Granted Feb 7, 2017·0 cites·5 claims
- 1737US8450615B2Ceramic multilayer substrateNOMIYA MASATO·Filed 2010·Granted May 28, 2013·0 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →