Inventor · disambiguated record
Kun-Chi Hsu
Also filed as: HSU KUN-CHI
4 granted patents·6 pending applications·7 citations·filing 2018–2021
60Inventor score
Files withPOWERTECH TECHNOLOGY INC10
Top patents by PatentIndex Score
10 records- 0182US10388535B1Wafer processing method with full edge trimmingPOWERTECH TECHNOLOGY INC·Filed 2018·Granted Aug 20, 2019·7 cites·10 claims
- 0251US11410945B2Semiconductor package having partial outer metal layer and packaging method thereofPOWERTECH TECHNOLOGY INC·Filed 2020·Granted Aug 9, 2022·0 cites·5 claims
- 0345US11658046B2Semiconductor packaging structure with back-deposited shielding layer and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2020·Granted May 23, 2023·0 cites·7 claims
- 0444US2022118631A1Head of a chip pickerPOWERTECH TECHNOLOGY INC·Filed 2021·Application pending·0 cites
- 0543US11587808B2Chip carrier devicePOWERTECH TECHNOLOGY INC·Filed 2020·Granted Feb 21, 2023·0 cites·6 claims
- 0641US2021339338A1Laser cutting method for a waferPOWERTECH TECHNOLOGY INC·Filed 2020·Application pending·0 cites
- 0738US2019247944A1Flux transfer methodPOWERTECH TECHNOLOGY INC·Filed 2018·Application pending·0 cites
- 0833US2019229064A1Laser color marking method for a semiconductor packagePOWERTECH TECHNOLOGY INC·Filed 2018·Application pending·0 cites
- 0930US2019267346A1Flux transfer tool and flux transfer methodPOWERTECH TECHNOLOGY INC·Filed 2018·Application pending·0 cites
- 1030US2019275600A1Flux transfer tool and flux transfer methodPOWERTECH TECHNOLOGY INC·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →