Inventor · disambiguated record
Sheng-Tou Tseng
Also filed as: TSENG SHENG-TOU
3 granted patents·5 pending applications·0 citations·filing 2017–2020
39Inventor score
Files withPOWERTECH TECHNOLOGY INC8
Top patents by PatentIndex Score
8 records- 0151US11410945B2Semiconductor package having partial outer metal layer and packaging method thereofPOWERTECH TECHNOLOGY INC·Filed 2020·Granted Aug 9, 2022·0 cites·5 claims
- 0245US11658046B2Semiconductor packaging structure with back-deposited shielding layer and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2020·Granted May 23, 2023·0 cites·7 claims
- 0343US11587808B2Chip carrier devicePOWERTECH TECHNOLOGY INC·Filed 2020·Granted Feb 21, 2023·0 cites·6 claims
- 0438US2019247944A1Flux transfer methodPOWERTECH TECHNOLOGY INC·Filed 2018·Application pending·0 cites
- 0533US2019229064A1Laser color marking method for a semiconductor packagePOWERTECH TECHNOLOGY INC·Filed 2018·Application pending·0 cites
- 0630US2019267346A1Flux transfer tool and flux transfer methodPOWERTECH TECHNOLOGY INC·Filed 2018·Application pending·0 cites
- 0730US2019275600A1Flux transfer tool and flux transfer methodPOWERTECH TECHNOLOGY INC·Filed 2018·Application pending·0 cites
- 0826US2019134742A1Method for laser markingPOWERTECH TECHNOLOGY INC·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →