Inventor · disambiguated record
Yu-Ting Lai
Also filed as: LAI YU · LAI YU T · LAI YU-TING
14 granted patents·8 pending applications·301 citations·filing 2000–2024
92Inventor score
Files withSILICONWARE PRECISION INDUSTRIES CO LTD10EXPACK IND CORPORATION5GREE ELECTRIC APPLIANCES INC ZHUHAI1IND TECH RES INST1KAO CHEN-LI1
Top patents by PatentIndex Score
22 records- 0193US6433420B1Semiconductor package with heat sink having air ventSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2001·Granted Aug 13, 2002·94 cites·9 claims
- 0291US12441075B2Box folding machineEXPACK IND CORPORATION·Filed 2024·Granted Oct 14, 2025·2 cites·5 claims
- 0391US6521997B1Chip carrier for accommodating passive componentSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2002·Granted Feb 18, 2003·84 cites·9 claims
- 0480US7102222B2Conductive trace structure and semiconductor package having the conductive trace structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2004·Granted Sep 5, 2006·39 cites·14 claims
- 0578US6617680B2Chip carrier, semiconductor package and fabricating method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2001·Granted Sep 9, 2003·36 cites·14 claims
- 0673US9908303B2Foldable box sealing machineEXPACK IND CORPORATION·Filed 2014·Granted Mar 6, 2018·2 cites·11 claims
- 0773US6441501B1Wire-bonded semiconductor device with improved wire arrangement scheme for minimizing abnormal wire sweepSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2000·Granted Aug 27, 2002·23 cites·4 claims
- 0864US11315231B2Industrial image inspection method and system and computer readable recording mediumIND TECH RES INST·Filed 2018·Granted Apr 26, 2022·1 cites·13 claims
- 0958US6927485B2Substrate for semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2002·Granted Aug 9, 2005·12 cites·11 claims
- 1053US6818538B2Ball grid array semiconductor package and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2003·Granted Nov 16, 2004·8 cites·10 claims
- 1148US2014292793A1Image processing method and image display deviceQISDA CORP·Filed 2014·Application pending·0 cites
- 1247US2009102063A1Semiconductor package and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2008·Application pending·0 cites
- 1343US11090895B2Feeding device for a box folding machineEXPACK IND CORPORATION·Filed 2020·Granted Aug 17, 2021·0 cites·8 claims
- 1443US2007278659A1Semiconductor package substrate and semiconductor package having the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2007·Application pending·0 cites
- 1542US11365019B2Strapping machineEXPACK IND CORPORATION·Filed 2020·Granted Jun 21, 2022·0 cites·8 claims
- 1642US11275823B2Authority configuration method and deviceGREE ELECTRIC APPLIANCES INC ZHUHAI·Filed 2017·Granted Mar 15, 2022·0 cites·8 claims
- 1742US11267674B2Strap feeding device for strapping machineEXPACK IND CORPORATION·Filed 2020·Granted Mar 8, 2022·0 cites·5 claims
- 1839US2006211232A1Method for Manufacturing Gold BumpsLIU MEI-JEN·Filed 2005·Application pending·0 cites
- 1936US2004072389A1Chip carrier, semiconductor package and fabricating method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2003·Application pending·0 cites
- 2036US2012131493A1Computer information display method and computer system using the sameLAI YU-TING·Filed 2011·Application pending·0 cites
- 2133US2003049890A1Method for depaositing a leading wire layer of the semiconductorUNITED MICROELECTRONICS CORP·Filed 2001·Application pending·0 cites
- 2231US2014195503A1Method and system for managing cache filesKAO CHEN-LI·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →