Inventor · disambiguated record
Min Gyum Kim
Also filed as: KIM MIN GYUM
13 granted patents·5 citations·filing 2013–2016
82Inventor score
Top patents by PatentIndex Score
13 records- 0177US9868751B2Phosphonium compound, epoxy resin composition including the same and semiconductor device prepared from the sameSAMSUNG SDI CO LTD·Filed 2015·Granted Jan 16, 2018·3 cites·21 claims
- 0260US9195136B2Resist underlayer composition, method of forming patterns and semiconductor integrated circuit device including the patternsKWON HYO-YOUNG·Filed 2013·Granted Nov 24, 2015·1 cites·14 claims
- 0354US9890307B2Phosphonium compound, epoxy resin composition including the same and semiconductor device prepared using the sameSAMSUNG SDI CO LTD·Filed 2016·Granted Feb 13, 2018·0 cites·15 claims
- 0454US9428632B2Quaternary phosphonium salt, epoxy resin composition for encapsulating semiconductor device and including the quaternary phosphonium salt, and semiconductor device encapsulated with the epoxy resin compositionKIM MIN GYUM·Filed 2013·Granted Aug 30, 2016·1 cites·13 claims
- 0552US9957348B2Pyridiniuivi-based compound, epoxy resin composition comprising same, and apparatus manufactured using sameSAMSUNG SDI CO LTD·Filed 2014·Granted May 1, 2018·0 cites·12 claims
- 0646US10047191B2Compound containing phosphonium ion, epoxy resin composition containing same, and device manufactured by using sameSAMSUNG SDI CO LTD·Filed 2014·Granted Aug 14, 2018·0 cites·19 claims
- 0746US9695294B2Epoxy resin composition for encapsulating semiconductor device and semiconductor device encapsulated using the sameKIM MIN GYUM·Filed 2013·Granted Jul 4, 2017·0 cites·5 claims
- 0846US9606438B2Resist underlayer composition, method of forming patterns, and semiconductor integrated circuit device including the patternCHEIL IND INC·Filed 2013·Granted Mar 28, 2017·0 cites·18 claims
- 0945US10385161B2Phosphonium-based compound, epoxy resin composition containing same, semiconductor device manufactured using sameSAMSUNG SDI CO LTD·Filed 2016·Granted Aug 20, 2019·0 cites·10 claims
- 1044US9896465B2Phosphonium compound, preparation method thereof, epoxy resin composition including the same, and semiconductor device prepared by using the sameSAMSUNG SDI CO LTD·Filed 2016·Granted Feb 20, 2018·0 cites·14 claims
- 1143US9890238B2Curing catalyst for epoxy resin composition, epoxy resin composition comprising same, and apparatus manufactured by using sameSAMSUNG SDI CO LTD·Filed 2014·Granted Feb 13, 2018·0 cites·9 claims
- 1234US9850390B2Epoxy resin composition for encapsulating semiconductor device and semiconductor device prepared using the sameSAMSUNG SDI CO LTD·Filed 2016·Granted Dec 26, 2017·0 cites·13 claims
- 1333US9870971B2Epoxy resin composition for encapsulating a semiconductor device and semiconductor device prepared using the sameSAMSUNG SDI CO LTD·Filed 2016·Granted Jan 16, 2018·0 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →