Inventor · disambiguated record
Jiayuan Fang
Also filed as: FANG JIAYUAN
9 granted patents·206 citations·filing 1994–2014
88Inventor score
Top patents by PatentIndex Score
9 records- 0190US6084779AGround and power patches on printed circuit board signal planes in the areas of integrated circuit chipsSIGRITY INC·Filed 1998·Granted Jul 4, 2000·119 cites·20 claims
- 0276US8874422B2Methods, systems, and computer-readable media for simulating interconnects in electronic packaging structuresLIU JIAN·Filed 2011·Granted Oct 28, 2014·5 cites·22 claims
- 0373US9818306B2System and method for assessing learning or training progressAFFICIENT ACAD INC·Filed 2014·Granted Nov 14, 2017·3 cites·21 claims
- 0471US5566083AMethod for analyzing voltage fluctuations in multilayered electronic packaging structuresUNIV NEW YORK STATE RES FOUND·Filed 1994·Granted Oct 15, 1996·58 cites·16 claims
- 0569US8682625B2Methods, systems, and computer-readable media for improving accuracy of network parameter in electromagnetic simulation and modelingLIU JIAN·Filed 2011·Granted Mar 25, 2014·3 cites·36 claims
- 0667US9542515B2Methods, systems, and computer-readable media for model order reduction in electromagnetic simulation and modelingLIU JIAN·Filed 2011·Granted Jan 10, 2017·3 cites·20 claims
- 0760US8694568B2Method for calculating causal impulse response from a band-limited spectrumLI KEZHOU·Filed 2011·Granted Apr 8, 2014·3 cites·23 claims
- 0859US9910945B2Methods, systems, and computer-readable media for reference impedance adaptation in electromagnetic simulation and modelingFANG JIAYUAN·Filed 2011·Granted Mar 6, 2018·2 cites·21 claims
- 0941US5504423AMethod for modeling interactions in multilayered electronic packaging structuresUNIV NEW YORK STATE RES FOUND·Filed 1994·Granted Apr 2, 1996·10 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →