Inventor · disambiguated record
Hidekazu Miyabe
Also filed as: MIYABE HIDEKAZU
3 granted patents·4 pending applications·9 citations·filing 2004–2019
60Inventor score
Top patents by PatentIndex Score
7 records- 0177US7749682B2Alkali-developable black photosensitive resin composition for forming light-shielding barrier wallNIPPON SHEET GLASS CO LTD·Filed 2008·Granted Jul 6, 2010·7 cites·12 claims
- 0270US8492070B2Photocurable and thermosetting resin composition and printed circuit boards made by using the sameKOJIMA HIDEAKI·Filed 2012·Granted Jul 23, 2013·2 cites·24 claims
- 0352US2008227883A1Photocurable and thermosetting resin composition and printed circuit boards made by using the sameTAIYO INK MFG CO LTD·Filed 2008·Application pending·0 cites
- 0448US11891474B2Curable resin composition, dry film, resin-clad copper foil, cured product, and electronic componentTAIYO HOLDINGS CO LTD·Filed 2019·Granted Feb 6, 2024·0 cites·20 claims
- 0546US2005215656A1Photocurable and thermosetting resin composition and printed circuit boards made by using the sameTAIYO INK MFG CO LTD·Filed 2005·Application pending·0 cites
- 0638US2009306243A1Composition for forming cured film pattern and method for producing cured film pattern by using the sameTAIYO INK MFG CO LTD·Filed 2009·Application pending·0 cites
- 0730US2005064336A1Unsaturated group-containing multi-branched compounds, curable compositions containing the same, and cured products thereofFiled 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →