Inventor · disambiguated record
Chang-Yong Park
Also filed as: PARK CHANG Y · PARK CHANG-YONG
14 granted patents·9 pending applications·106 citations·filing 1998–2024
90Inventor score
Files withSAMSUNG ELECTRONICS CO LTD14PARK CHANG-YONG3DONGJIN SEMICHEM CO LTD2LG ELECTRONICS INC2SAMSUNG ELECTONICS CO LTD1
Top patents by PatentIndex Score
23 records- 0194US7215026B2Semiconductor module and method of forming a semiconductor moduleSAMSUNG ELECTONICS CO LTD·Filed 2005·Granted May 8, 2007·42 cites·36 claims
- 0288US7518873B2Heat spreader, semiconductor package module and memory module having the heat spreaderSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Apr 14, 2009·20 cites·37 claims
- 0387US7606035B2Heat sink and memory module using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Oct 20, 2009·19 cites·23 claims
- 0475US9887164B2Semiconductor package and semiconductor device including an electromagnetic wave shielding memberSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Feb 6, 2018·2 cites·20 claims
- 0570US12051187B2AI-based new learning model generation system for vision inspection on product production lineLG ELECTRONICS INC·Filed 2019·Granted Jul 30, 2024·2 cites·15 claims
- 0668US7705449B2Cooling apparatus for memory moduleSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Apr 27, 2010·4 cites·42 claims
- 0764US12056210B2AI-based pre-training model determination system, and AI-based vision inspection management system using same for product production linesLG ELECTRONICS INC·Filed 2019·Granted Aug 6, 2024·1 cites·16 claims
- 0863US9786624B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Oct 10, 2017·1 cites·20 claims
- 0957US7675176B2Semiconductor package and module printed circuit board for mounting the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Mar 9, 2010·1 cites·19 claims
- 1052US2025103468A1System on chip and electronic device comprising the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1151US2007161224A1Semiconductor module and method of forming a semiconductor modulePARK CHANG-YONG·Filed 2007·Application pending·0 cites
- 1250US2007069378A1Semiconductor module and method of forming a semiconductor modulePARK CHANG-YONG·Filed 2006·Application pending·0 cites
- 1347US9761519B2Package substrate and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Sep 12, 2017·0 cites·18 claims
- 1444US10043678B2Metal film polishing slurry composition, and method for reducing scratches generated when polishing metal film by using sameDONGJIN SEMICHEM CO LTD·Filed 2014·Granted Aug 7, 2018·0 cites·8 claims
- 1544US7172106B2Printed circuit board which can be connected with pin connector and method of manufacturing the printed circuit boardSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Feb 6, 2007·1 cites·9 claims
- 1644US7005735B2Array printed circuit boardSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Feb 28, 2006·3 cites·12 claims
- 1744US2008289356A1Apparatus for Producing Ice VesselPARK CHANG YONG·Filed 2006·Application pending·0 cites
- 1842US2008044951A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 1939US2006228878A1Semiconductor package repair methodSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 2033US2005160741A1Apparatus and method for producing ice container using ice powdersFiled 2003·Application pending·0 cites
- 2132US2016111169A1Memory test apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2015·Application pending·0 cites
- 2231US2020048498A1Chemical mechanical polishing slurry compositionDONGJIN SEMICHEM CO LTD·Filed 2018·Application pending·0 cites
- 2330US6259751B1Circuit and method for removing interference in digital communication systemSAMSUNG ELECTRONICS CO LTD·Filed 1998·Granted Jul 10, 2001·10 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →