Inventor · disambiguated record
Sergei Voronov
Also filed as: VORONOV SERGEI · VORONOV SERGEI L
14 granted patents·6 pending applications·272 citations·filing 2002–2017
92Inventor score
Top patents by PatentIndex Score
20 records- 0193US6661876B2Mobile miniature X-ray sourceMOXTEK INC·Filed 2002·Granted Dec 9, 2003·156 cites·28 claims
- 0289US7169687B2Laser micromachining methodINTEL CORP·Filed 2004·Granted Jan 30, 2007·43 cites·24 claims
- 0388US7303977B2Laser micromachining methodINTEL CORP·Filed 2004·Granted Dec 4, 2007·40 cites·17 claims
- 0483US7611966B2Dual pulsed beam laser micromachining methodINTEL CORP·Filed 2005·Granted Nov 3, 2009·8 cites·17 claims
- 0578US7807573B2Laser assisted chemical vapor deposition for backside die marking and structures formed therebyINTEL CORP·Filed 2008·Granted Oct 5, 2010·8 cites·11 claims
- 0673US9859248B2Laser die backside film removal for integrated circuit (IC) packagingINTEL CORP·Filed 2016·Granted Jan 2, 2018·2 cites·20 claims
- 0767US9412702B2Laser die backside film removal for integrated circuit (IC) packagingINTEL CORP·Filed 2013·Granted Aug 9, 2016·2 cites·12 claims
- 0867US8076776B2Integrated circuit package having security feature and method of manufacturing sameBHATE DHRUV P·Filed 2009·Granted Dec 13, 2011·7 cites·10 claims
- 0962US9430685B2Substrate markingsINTEL CORP·Filed 2013·Granted Aug 30, 2016·1 cites·19 claims
- 1062US7985957B2Methods for concealing surface defectsINTEL CORP·Filed 2008·Granted Jul 26, 2011·2 cites·12 claims
- 1157US8426250B2Laser-assisted chemical singulation of a waferVAKANAS GEORGE·Filed 2008·Granted Apr 23, 2013·1 cites·19 claims
- 1255US8525136B2Work piece with concealed surface defectsVORONOV SERGEI·Filed 2011·Granted Sep 3, 2013·1 cites·20 claims
- 1344US2008242054A1Dicing and drilling of wafersANTONELLI ANDY·Filed 2007·Application pending·0 cites
- 1443US9472505B2Die or substrate marking using a laserINTEL CORP·Filed 2013·Granted Oct 18, 2016·0 cites·16 claims
- 1543US8173552B2Method of fabricating an identification mark utilizing a liquid film assisted by a laserVAKANAS GEORGE P·Filed 2009·Granted May 8, 2012·1 cites·13 claims
- 1642US2008156780A1Substrate markingsVORONOV SERGEI·Filed 2006·Application pending·0 cites
- 1740US2010129984A1Wafer singulation in high volume manufacturingVAKANAS GEORGE·Filed 2008·Application pending·0 cites
- 1838US2006088984A1Laser ablation methodINTEL CORP·Filed 2004·Application pending·0 cites
- 1935US2018233410A1Wafer dicing methodsPSEMI CORP·Filed 2017·Application pending·0 cites
- 2034US2014175657A1Methods to improve laser mark contrast on die backside film in embedded die packagesOKA MIHIR A·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →