Inventor · disambiguated record
Hiroshi Ohtsubo
Also filed as: OHTSUBO HIROSHI
24 granted patents·548 citations·filing 1982–2012
96Inventor score
Top patents by PatentIndex Score
24 records- 0190US7060367B2Cutting blade and method of producing the sameKAI R&D CENTER CO LTD·Filed 2001·Granted Jun 13, 2006·84 cites·34 claims
- 0290US6886262B2Razor and its handleKAI R&D CENTER CO LTD·Filed 2003·Granted May 3, 2005·77 cites·8 claims
- 0385US5338508AAlloy steel powders for injection molding use, their compounds and a method for making sintered parts from the sameKAWASAKI STEEL CO·Filed 1992·Granted Aug 16, 1994·65 cites·2 claims
- 0482US4533806AMethod of manufacturing bimetallic tubesKAWASAKI STEEL CO·Filed 1982·Granted Aug 6, 1985·33 cites·6 claims
- 0580US8614119B2Semiconductor device with heat spreaderFUKUDA TOMOYUKI·Filed 2012·Granted Dec 24, 2013·4 cites·8 claims
- 0677US4964907ASintered bodies and production process thereofKAWASAKI STEEL CO·Filed 1989·Granted Oct 23, 1990·32 cites·5 claims
- 0776US8278743B2Semiconductor device with heat spreaderFUKUDA TOMOYUKI·Filed 2011·Granted Oct 2, 2012·3 cites·20 claims
- 0876US4971755AMethod for preparing powder metallurgical sintered productKAWASAKI STEEL CO·Filed 1989·Granted Nov 20, 1990·33 cites·29 claims
- 0975US5613849ADental care material and manufacturing methodINJEX CORP·Filed 1995·Granted Mar 25, 1997·34 cites·18 claims
- 1073US5773099ADental care material and manufacturing methodINJEX CORP·Filed 1996·Granted Jun 30, 1998·30 cites·18 claims
- 1172US5939018AMartensitic stainless steels for seamless steel pipeKAWASAKI STEEL CO·Filed 1996·Granted Aug 17, 1999·19 cites·4 claims
- 1270US5108492ACorrosion-resistant sintered alloy steels and method for making sameKAWASAKI STEEL CO·Filed 1989·Granted Apr 28, 1992·25 cites·12 claims
- 1369US5033036AReproducing apparatus including means for gradually varying a mixing ratio of first and second channel signal in accordance with a voice signalPIONEER ELECTRONIC CORP·Filed 1990·Granted Jul 16, 1991·43 cites·5 claims
- 1466US8621757B2Coated cutting edge of a blade memberAKARI KOICHIRO·Filed 2008·Granted Jan 7, 2014·5 cites·14 claims
- 1565US8614505B2Semiconductor device with heat spreaderFUKUDA TOMOYUKI·Filed 2012·Granted Dec 24, 2013·1 cites·20 claims
- 1665US8564108B2Semiconductor device with heat spreaderFUKUDA TOMOYUKI·Filed 2012·Granted Oct 22, 2013·1 cites·11 claims
- 1759US4604887ADuplex stainless steel seamless pipe and a method for producing the sameKAWASAKI STEEL CO·Filed 1984·Granted Aug 12, 1986·9 cites·2 claims
- 1856US7781259B2Method of manufacturing a semiconductor using a rigid substrateFUJITSU SEMICONDUCTOR LTD·Filed 2006·Granted Aug 24, 2010·1 cites·5 claims
- 1956US5458670AIron powder and mixed powder for powder metallurgy as well as method of producing iron powderKAWASAKI STEEL CO·Filed 1993·Granted Oct 17, 1995·10 cites·5 claims
- 2056US5380476AMethod of debinding for injection molded objectsKAWASAKI STEEL CO·Filed 1991·Granted Jan 10, 1995·18 cites·8 claims
- 2154US5067979ASintered bodies and production process thereofKAWASAKI STEEL CO·Filed 1990·Granted Nov 26, 1991·14 cites·5 claims
- 2249US8522645B2Blade member, and edge working apparatus for the blade memberUEMURA KENSUKE·Filed 2008·Granted Sep 3, 2013·0 cites·4 claims
- 2343US5507853AIron powder and mixed powder for powder metallurgy as well as method of producing iron powderKAWASAKI STEEL CO·Filed 1995·Granted Apr 16, 1996·7 cites·2 claims
- 2438US7122402B2Method of manufacturing a semiconductor device using a rigid substrate including the vent-end edge portion of the substrate has a thickness smaller than the other portions of the substrateFUJITSU LTD·Filed 2004·Granted Oct 17, 2006·0 cites·3 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →