Inventor · disambiguated record
Tsuyoshi Hamatani
Also filed as: HAMATANI TSUYOSHI
11 granted patents·4 pending applications·242 citations·filing 2000–2009
91Inventor score
Top patents by PatentIndex Score
15 records- 0195US6693358B2Semiconductor chip, wiring board and manufacturing process thereof as well as semiconductor deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Feb 17, 2004·117 cites·2 claims
- 0289US6498393B2Semiconductor device and method for the fabrication thereofMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Dec 24, 2002·44 cites·11 claims
- 0384US7391114B2Electrode pad section for external connectionMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Granted Jun 24, 2008·17 cites·10 claims
- 0479US7777304B2Semiconductor devicePANASONIC CORP·Filed 2006·Granted Aug 17, 2010·7 cites·19 claims
- 0574US7202565B2Semiconductor device which employs an interlayer insulating film of a low mechanical strength and a highly reliable metal pad, and a method of manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted Apr 10, 2007·19 cites·10 claims
- 0673US7125751B2Semiconductor device and method for the fabrication thereof grinding frame portion such that plural electrode constituent portionsMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Granted Oct 24, 2006·4 cites·1 claims
- 0773US6856026B2Semiconductor chip, wiring board and manufacturing process thereof as well as semiconductor deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Feb 15, 2005·17 cites·14 claims
- 0865US7309624B2Semiconductor device and method for the fabrication thereof including grinding a major portion of the frameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2006·Granted Dec 18, 2007·2 cites·2 claims
- 0961US6603194B2Lead frame and method for fabricating resin-encapsulated semiconductor device using the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Aug 5, 2003·9 cites·13 claims
- 1055US6835600B2Lead frame and method for fabricating resin-encapsulated semiconductor device using the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Dec 28, 2004·6 cites·4 claims
- 1146US2009184428A1Semiconductor device and method for manufacturing the samePANASONIC CORP·Filed 2009·Application pending·0 cites
- 1245US7622792B2Semiconductor device and method of manufacturing the samePANASONIC CORP·Filed 2006·Granted Nov 24, 2009·0 cites·11 claims
- 1341US2007138638A1Semiconductor deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2006·Application pending·0 cites
- 1441US2007023927A1Semiconductor deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2006·Application pending·0 cites
- 1540US2003038359A1Semiconductor device and method for the fabrication thereofFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →