Inventor · disambiguated record
Kenzo Ishida
Also filed as: ISHIDA KENZO
14 granted patents·1 pending application·288 citations·filing 1996–2008
93Inventor score
Top patents by PatentIndex Score
15 records- 0195US6020561APrinted circuit substrate with solder formed on pad-on-via and pad-off-via contacts thereofINTEL CORP·Filed 1996·Granted Feb 1, 2000·138 cites·4 claims
- 0274US6422303B1Silent heat exchanger and fan assemblyINTEL CORP·Filed 2000·Granted Jul 23, 2002·16 cites·19 claims
- 0373US5660321AMethod for controlling solder bump height and volume for substrates containing both pad-on and pad-off via contactsINTEL CORP·Filed 1996·Granted Aug 26, 1997·31 cites·20 claims
- 0472US6173576B1Cooling unit for an integrated circuit packageINTEL CORP·Filed 1999·Granted Jan 16, 2001·41 cites·19 claims
- 0567US7724990B2Fiber array unit with integrated optical power monitorAIDI CORP·Filed 2008·Granted May 25, 2010·5 cites·8 claims
- 0664US6798137B2Apparatus and method for warpage compensation of a display panel substrate assemblyINTEL CORP·Filed 2002·Granted Sep 28, 2004·8 cites·10 claims
- 0762US6697553B2Compact, low insertion loss, high yield arrayed waveguide gratingJDS UNIPHASE CORP·Filed 2002·Granted Feb 24, 2004·9 cites·78 claims
- 0854US6665475B2Precision fiber optic alignment and attachment apparatusJDS UNIPHASE CORP·Filed 2001·Granted Dec 16, 2003·4 cites·39 claims
- 0952US6664511B2Package for optical componentsJDS UNIPHASE CORP·Filed 2002·Granted Dec 16, 2003·3 cites·12 claims
- 1051US7171743B2Apparatus and method for warpage compensation of a display panel substrate assemblyINTEL CORP·Filed 2004·Granted Feb 6, 2007·2 cites·10 claims
- 1149US7330620B2Low loss funnel-type PLC optical splitter with input cladding mode absorption structure and/or output segmented taper structureAIDI CORP·Filed 2007·Granted Feb 12, 2008·2 cites·6 claims
- 1249US6606425B1Transfer molded packages with embedded thermal insulationJDS UNIPHASE CORP·Filed 2002·Granted Aug 12, 2003·2 cites·13 claims
- 1349US6278185B1Semi-additive process (SAP) architecture for organic leadless grid array packagesINTEL CORP·Filed 1998·Granted Aug 21, 2001·19 cites·9 claims
- 1441US6785148B1Easy mount socketINTEL CORP·Filed 1998·Granted Aug 31, 2004·8 cites·14 claims
- 1529US2002089836A1Injection molded underfill package and method of assemblyFiled 1999·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →