Inventor · disambiguated record
Akira Ichida
Also filed as: ICHIDA AKIRA
8 granted patents·906 citations·filing 1993–2003
91Inventor score
Top patents by PatentIndex Score
8 records- 0197US6261648B1Plasma facing components of nuclear fusion reactors employing tungsten materialsJAPAN ATOMIC ENERGY RES INST·Filed 1995·Granted Jul 17, 2001·368 cites·2 claims
- 0296US6610375B2Plasma facing components of nuclear fusion reactors employing tungsten materialsJAPAN ATOMIC ENERGY RES INST·Filed 2001·Granted Aug 26, 2003·364 cites·4 claims
- 0385US6518667B1Semiconductor package using micro balls and production method thereofALLIED MATERIAL CORP·Filed 2000·Granted Feb 11, 2003·45 cites·16 claims
- 0477US5493153APlastic-packaged semiconductor device having a heat sink matched with a plastic packageTOKYO TUNGSTEN KK·Filed 1993·Granted Feb 20, 1996·59 cites·38 claims
- 0573US6475429B2Heat sink substrate consisting essentially of copper and molybdenum and method of manufacturing the sameTOKYO TUNGSTEN KK·Filed 2001·Granted Nov 5, 2002·19 cites·19 claims
- 0668US6271585B1Heat sink substrate consisting essentially of copper and molybdenum and method of manufacturing the sameTOKYO TUNGSTEN KK·Filed 1998·Granted Aug 7, 2001·32 cites·27 claims
- 0755US6926861B2Semiconductor package and method for producing heat-radiating substrate for itTOKYO TUNGSTEN KK·Filed 2003·Granted Aug 9, 2005·6 cites·7 claims
- 0847US6693353B1Semiconductor package and method for producing heat-radiating substrate for itTOKYO TUNGSTEN KK·Filed 1999·Granted Feb 17, 2004·13 cites·6 claims
Join the waitlist — get patent alerts
Get an alert when Akira Ichida files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →