Inventor · disambiguated record
Yoshihiko Nemoto
Also filed as: NEMOTO YOSHIHIKO
39 granted patents·9 pending applications·862 citations·filing 1995–2020
98Inventor score
Files withFUJI XEROX CO LTD21RENESAS TECH CORP6ROHM CO LTD5MITSUBISHI ELECTRIC CORP3FUJIFILM BUSINESS INNOVATION CORP2
Top patents by PatentIndex Score
48 records- 0199US7709932B2Semiconductor wafer having a separation portion on a peripheral areaSHINKO ELECTRIC IND CO·Filed 2005·Granted May 4, 2010·270 cites·1 claims
- 0296US7218131B2Inspection probe, method for preparing the same, and method for inspecting elementsNEC CORP·Filed 2005·Granted May 15, 2007·44 cites·10 claims
- 0395US7259454B2Semiconductor chip manufacturing method, semiconductor chip, semiconductor device manufacturing method, and semiconductor deviceTOSHIBA KK·Filed 2005·Granted Aug 21, 2007·37 cites·2 claims
- 0494US7253527B2Semiconductor chip production method, semiconductor device production method, semiconductor chip, and semiconductor deviceRENESAS TECH CORP·Filed 2006·Granted Aug 7, 2007·34 cites·7 claims
- 0593US6943056B2Semiconductor device manufacturing method and electronic equipment using sameRENESAS TECH CORP·Filed 2003·Granted Sep 13, 2005·70 cites·17 claims
- 0692US7432196B2Semiconductor chip manufacturing method, semiconductor chip, semiconductor device manufacturing method, and semiconductor deviceROHM CO LTD·Filed 2006·Granted Oct 7, 2008·23 cites·8 claims
- 0790US7282444B2Semiconductor chip and manufacturing method for the same, and semiconductor deviceTOSHIBA KK·Filed 2004·Granted Oct 16, 2007·62 cites·24 claims
- 0888US10593114B2Information processing systemFUJI XEROX CO LTD·Filed 2017·Granted Mar 17, 2020·5 cites·7 claims
- 0988US7148576B2Semiconductor device and method of fabricating the sameRENESAS TECH CORP·Filed 2005·Granted Dec 12, 2006·14 cites·2 claims
- 1087US7288481B2Semiconductor device having through electrode and method of manufacturing the sameRENESAS TECH CORP·Filed 2005·Granted Oct 30, 2007·16 cites·8 claims
- 1184US10839773B2Terminal device and non-transitory computer-readable mediumFUJI XEROX CO LTD·Filed 2017·Granted Nov 17, 2020·3 cites·10 claims
- 1284US10358042B2Underwater mobile bodyFUJI XEROX CO LTD·Filed 2017·Granted Jul 23, 2019·3 cites·2 claims
- 1384US6734084B1Method of manufacturing a semiconductor device with recesses using anodic oxideMITSUBISHI ELECTRIC CORP·Filed 2003·Granted May 11, 2004·48 cites·5 claims
- 1483US7195988B2Semiconductor wafer and method of manufacturing a semiconductor device using a separation portion on a peripheral area of the semiconductor waferSHINKO ELECTRIC IND·Filed 2004·Granted Mar 27, 2007·31 cites·7 claims
- 1582US7122457B2Semiconductor chip production method, semiconductor device production method, semiconductor chip, and semiconductor deviceROHM CO LTD·Filed 2004·Granted Oct 17, 2006·30 cites·8 claims
- 1679US6995455B2Semiconductor deviceROHM CO LTD·Filed 2003·Granted Feb 7, 2006·24 cites·14 claims
- 1778US10716299B2Underwater mobile body and non-transitory computer readable mediumFUJI XEROX CO LTD·Filed 2017·Granted Jul 21, 2020·3 cites·19 claims
- 1878US5774356AImage forming apparatus with job priority management of output processingFUJI XEROX CO LTD·Filed 1995·Granted Jun 30, 1998·58 cites·14 claims
- 1976US10685651B2Information processing apparatusFUJI XEROX CO LTD·Filed 2018·Granted Jun 16, 2020·2 cites·12 claims
- 2076US7638421B2Manufacturing method for semiconductor device and semiconductor deviceROHM CO LTD·Filed 2007·Granted Dec 29, 2009·6 cites·9 claims
- 2176US7416963B2Manufacturing method of semiconductor deviceUMEMOTO MITSUO·Filed 2005·Granted Aug 26, 2008·9 cites·14 claims
- 2275US10199855B2Power receiving apparatus and wireless power-transfer systemFUJI XEROX CO LTD·Filed 2017·Granted Feb 5, 2019·2 cites·8 claims
- 2371US10620809B2Display device and non-transitory computer readable mediumFUJI XEROX CO LTD·Filed 2017·Granted Apr 14, 2020·1 cites·10 claims
- 2471US9864315B2Image forming apparatusFUJI XEROX CO LTD·Filed 2015·Granted Jan 9, 2018·1 cites·15 claims
- 2569US7227262B2Manufacturing method for semiconductor device and semiconductor deviceSANYO ELECTRIC CO·Filed 2004·Granted Jun 5, 2007·13 cites·1 claims
- 2667US11430188B2Information processing systemFUJIFILM BUSINESS INNOVATION CORP·Filed 2020·Granted Aug 30, 2022·0 cites·17 claims
- 2767US9948405B1Underwater mobile bodyFUJI XEROX CO LTD·Filed 2017·Granted Apr 17, 2018·1 cites·7 claims
- 2867US7452751B2Semiconductor device and method of manufacturing the sameRENESAS TECH CORP·Filed 2005·Granted Nov 18, 2008·3 cites·6 claims
- 2966US8280177B2Encoding device using parallelized encoding, decoding device using parallelized decoding, and image forming device, method, and program storage medium including the sameKATO SEISHIRO·Filed 2009·Granted Oct 2, 2012·3 cites·17 claims
- 3066US7235428B2Semiconductor device production methodROHM CO LTD·Filed 2003·Granted Jun 26, 2007·11 cites·14 claims
- 3165US6686660B2Semiconductor deviceRENESAS TECH CORP·Filed 2002·Granted Feb 3, 2004·12 cites·3 claims
- 3263US11682392B2Information processing apparatusFUJIFILM BUSINESS INNOVATION CORP·Filed 2020·Granted Jun 20, 2023·0 cites·12 claims
- 3363US8089163B2Semiconductor device production method and semiconductor deviceTANIDA KAZUMASA·Filed 2006·Granted Jan 3, 2012·2 cites·15 claims
- 3462US8093701B2Semiconductor device manufacturing method and electronic equipment using sameNEMOTO YOSHIHIKO·Filed 2005·Granted Jan 10, 2012·3 cites·1 claims
- 3556US6875672B2Method of manufacturing a semiconductor device with penetration electrodes that protrude from a rear side of a substrate formed by thinning the substrateMITSUBISHI ELECTRIC CORP·Filed 2003·Granted Apr 5, 2005·13 cites·10 claims
- 3652US10432010B2Electronic apparatus, power supply device, and wireless power supply systemFUJI XEROX CO LTD·Filed 2017·Granted Oct 1, 2019·0 cites·19 claims
- 3749US10083049B2Information processing device and method, and non-transitory computer readable mediumFUJI XEROX CO LTD·Filed 2016·Granted Sep 25, 2018·0 cites·18 claims
- 3846US2018272612A1Three-dimensional shape forming apparatus, information processing apparatus, and non-transitory computer readable mediumFUJI XEROX CO LTD·Filed 2017·Application pending·0 cites
- 3942US2018113661A1Information processing device, image file data structure, and non-transitory computer-readable mediumFUJI XEROX CO LTD·Filed 2017·Application pending·0 cites
- 4040US9811719B2Information processing apparatus and method, and non-transitory computer readable mediumFUJI XEROX CO LTD·Filed 2015·Granted Nov 7, 2017·0 cites·9 claims
- 4140US2018137840A1Terminal apparatus and non-transitory computer readable mediumFUJI XEROX CO LTD·Filed 2017·Application pending·0 cites
- 4239US2003062631A1Semiconductor device and method of fabricating the sameMITSUBISHI ELECTRIC CORP·Filed 2002·Application pending·0 cites
- 4338US2017180593A1Information processing device, image processing device, information processing method, and non-transitory computer readable mediumFUJI XEROX CO LTD·Filed 2016·Application pending·0 cites
- 4437US2016212388A1Surveillance apparatusFUJI XEROX CO LTD·Filed 2015·Application pending·0 cites
- 4537US2018099733A1Underwater mobile body and underwater communication systemFUJI XEROX CO LTD·Filed 2017·Application pending·0 cites
- 4637US2007096332A1Electronic component, module, module assembling method, module identification method and module environment setting methodSATOH TOMOTOSHI·Filed 2004·Application pending·0 cites
- 4736US2016212279A1Surveillance systemFUJI XEROX CO LTD·Filed 2015·Application pending·0 cites
- 4835US6154287APrinting deviceFUJI XEROX CO LTD·Filed 1997·Granted Nov 28, 2000·5 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →